High resolution 8k UHD displays for emerging technologies like connected cars, IoT, and AR/VR (Augmented/Virtual Reality) require high bandwidth to support the high-resolution transmission. MIPI DSI is the widely used display interface, but the bandwidth provided by PHY layers isn’t sufficient enough to support the high-resolution displays; therefore, a compression technique like DSC (Display Stream Compression) is required. One of our recent blog discussed about DSC 1.2 in HDMI 2.1 – High Resolution Displays for Mobile, TV, PC and Automotive Enabled by DSC 1.2 in HDMI 2.1. In this blog, we will see how DSC 1.2 enables MIPI DSI to support the high-resolution displays for emerging applications.
We recently published the VIP Newsletter for Jan 2019. It provides the latest information on Verification IP, including blogs, trending topics, industry-leading announcements, in-depth technical articles, videos and webinars. The Q1 2019 edition of the newsletter is now available, covering content on new VIP for next-generation protocol specifications as well as updates on existing VIP. In case you missed the latest buzz on Verification IP, you can read it here.
Posted in Uncategorized |
We recently published the VIP Newsletter for Q4 2018, containing trending topics, leading solutions, in depth technical articles, videos, webinars, and updates on next generation protocols. The newsletter covers content on PCIe 5.0, Arm® AMBA® 5 ACE5 and AXI5, CCIX and next generation MIPI and display protocols and applications ranging from AI, Cloud, Display, Storage and Networking. In case you missed the latest buzz on Verification IP, you can read it here.
Posted in ACE, AMBA, Audio, Automotive, AXI, Camera, CCIX, CHI, Data Center, Debug, DesignWare, Display, events, HDCP, HDMI, Interconnects, Interface Subsystems, MIPI, Mobile SoC, MPHY, PCIe, Processor Subsystems, Soundwire, Storage, Test Suites, Uncategorized |
With the rise of cloud computing and large scale data centers, both developers and consumers are demanding for more efficient ways to rapidly access their data. Seeing the advantage of its high performance, the storage industry is quickly adopting the Non-Volatile Memory Express (NVMe) standard. The NVMe™ standard continues to push the storage envelope with version 1.3 and beyond in all types of computing environments from mobile to data center. One of the key features of the NVMe™ standard is its ability to handle virtualization.
In mid-2014, the USB Type-C standard was announced, which provided a thinner, reversible connector and ever evolving ecosystem of new platforms like MHL, DisplayPort, HDMI, and Thunderbolt over Type-C. USB Type-C is quickly being integrated into most high end and newly-released mid-range smart phones offering the reversible Type-C connector. It is also becoming the connector of choice for IoT, display, gaming, and other emerging applications. Synopsys’ Subsystem Verification Solution for USB Type-C™ is rapidly being adopted by customers. Read more about the adoption of Synopsys’ USB Type-C Subsystem Verification Solution by ASIX.
SoC performance is a key competitive advantage in the marketplace, and the choice and configuration of protocol IP and interconnects is geared towards maximizing said performance. A case in point is the use of HBM (High Bandwidth Memory) technology and memory controllers. Currently in its third generation, HBM boasts of high-performance while using lesser power in a substantially smaller form factor than DDR. That said, how do teams ensure that the performance is delivered in the context of their SoC design?
We recently published the VIP Newsletter for Jan 2018, containing trending topics, leading solutions, in depth technical articles, videos, webinars, and updates on next generation protocols. In case you missed the latest buzz on Verification IP, you can read it here.
Posted in ACE, AMBA, Automotive, AXI, C-PHY, Camera, CHI, CSI, D-PHY, Data Center, DDR, Debug, Flash, Interconnects, LPDDR, Memory, Methodology, MIPI, Mobile SoC, NVMe, PCIe, Processor Subsystems, SPI, Storage, SystemVerilog, Test Suites, Type C, Uncategorized, UVM |
Ever since Arm released the Arm® AMBA® 5 AHB5 protocol specifications, questions have arisen among users in the design and verification community—”Why AHB5?”, “What is new in AHB5?” etc. This post initiates a short series of blogs in which we will address these questions and introduce the new features of AMBA 5 AHB5.
Higher storage performance at a lower cost can create a bottleneck in the design of storage devices. In order to achieve higher performance, devices must use on chip DRAM, which adds to the overall cost. This is where Unified Memory Extension (UME), a JEDEC specification, comes into the picture. It is defined as extension to the JEDEC UFS (Universal Flash Storage) specification. JEDEC UFS device uses NAND flash technology for data storage. Unified Memory (UM) allows users to use part of the host memory as the device’s internal memory. Since the host memory is already available in large capacities, this mechanism provides a much bigger space for the device to use as a Write Buffer (WB) cache or to store information such as Logical to Physical (L2P) address translation tables. The UM area is physically located on the host side but ultimately belongs to the device, thereby replacing the device-integrated RAM, and reducing overall cost. Large space availability means the device can store larger amounts of WB of L2P table information resulting in higher storage performance.
First USB 3.2 VIP and TestSuite: Enhances the Verification Solution for USB IP, SoC and Type-C Subsystems
USB has literally become universal and present in every device ranging from smart phones and personal computers, IoT and wearables, storage and networking, consumer electronics and gaming consoles, automotive and many other emerging verticals. The success of USB can be attributed to innovation with each new generation—the capability to transfer data as well as supply power for charging devices and ease-of-use with a variety of connectors and form factors.