SoC designs are growing more complex, not just by the sheer number of transistors that can be packed into one design, but the emergence of different interconnect methods you must use to connect chip internals and to connect to the outside world. Becoming an expert on each of the interconnect protocols is not going to shorten the verification schedules, reduce design productivity and expose design bugs that might only be found when used by the end consumer.
USB4 is the next generation of the Universal Serial Bus and a major update to the interface in speed and functionality. USB4 has incorporated Thunderbolt 3 capabilities, which extends support of USB interface to existing PCIE, and DisplayPort over the same USB Type-C connector. USB4 doubles the maximum overall throughput from 20Gbps to 40Gbps enabling optimized HD video and data transfer simultaneously. USB4 enables many applications using USB Type-C, which already supports power delivery, USB 3.2, USB 2.0 and other alternative protocols.
We recently published the VIP Newsletter for Apr 2019, containing trending topics, leading solutions, in depth technical articles, videos, webinars, and updates on next generation protocols. In case you missed the latest buzz on Verification IP, you can read it here.
We recently published the VIP Newsletter for Q4 2018, containing trending topics, leading solutions, in depth technical articles, videos, webinars, and updates on next generation protocols. The newsletter covers content on PCIe 5.0, Arm® AMBA® 5 ACE5 and AXI5, CCIX and next generation MIPI and display protocols and applications ranging from AI, Cloud, Display, Storage and Networking. In case you missed the latest buzz on Verification IP, you can read it here.
Posted in ACE, AMBA, Audio, Automotive, AXI, Camera, CCIX, CHI, Data Center, Debug, DesignWare, Display, events, HDCP, HDMI, Interconnects, Interface Subsystems, MIPI, Mobile SoC, MPHY, PCIe, Processor Subsystems, Soundwire, Storage, Test Suites, Uncategorized
We recently published the VIP Newsletter for Q3 2018, containing trending topics, leading solutions, in depth technical articles, videos, webinars, and updates on next generation protocols. The newsletter covers content on DFI 5.0 for DDR5/LPDDR5, NVMe 1.3, USB 3.2, PCIe 5.0, next generation gaming displays, MIPI CSI-2 v2.1 for Automotive and IoT, and Verdi performance analyzer and protocol debug. In case you missed the latest buzz on Verification IP, you can read it here.
We recently published the VIP Newsletter for Jan 2018, containing trending topics, leading solutions, in depth technical articles, videos, webinars, and updates on next generation protocols. In case you missed the latest buzz on Verification IP, you can read it here.
Posted in ACE, AMBA, Automotive, AXI, C-PHY, Camera, CHI, CSI, D-PHY, Data Center, DDR, Debug, Flash, Interconnects, LPDDR, Memory, Methodology, MIPI, Mobile SoC, NVMe, PCIe, Processor Subsystems, SPI, Storage, SystemVerilog, Test Suites, Type C, Uncategorized, UVM
Industry’s First Source Code Test Suite and Verification IP for Arm AMBA ACE5 and AXI5 Enables Early Adopter Success
Synopsys offers a broad set of verification solutions for next generation Arm® AMBA® protocols, including AMBA CHI Issue B, and verification automation solutions including Auto SoC Testbench Generation and AutoPerformance for AMBA protocols, which designers have widely adopted and achieved numerous tape-out successes. We continue the rapid expansion of Synopsys’ verification solutions for AMBA protocols and strengthen our leadership with our latest offering of source code test suites and VIP for AMBA ACE5 and AXI5, which are already in use by early adopters of the new specifications.
Arm TechCon 2017 took place at Santa Clara on 24-26th Oct, 2017. This year, Synopsys’ Arm® AMBA® protocol experts were on hand to demonstrate our verification automation solutions for Arm AMBA Coherent Interconnects. Synopsys Auto SoC Testbench generation solution enables easy and quick integration and configuration of hundreds of coherent and non-coherent AMBA ports and corresponding VIP instances. Our experts also introduced our AMBA AutoPerformance solution to generate AMBA(CHI/ACE/AXI) interconnect performance verification stimulus. The AutoPerformance solution, based on Arm traffic profile specification, enables user to define traffic profiles for measurement of performance metrics like throughput, latency etc., and the stimulus is driven by VIP for AMBA (CHI/ACE/AXI).
The ordering of memory transactions in Arm® AMBA® protocol is a significant requirement, i.e. the sequence of memory updates/accesses must follow a defined ordering as per the specification. Ordering is important for synchronization events by a processor with respect to retiring load/store instructions. AMBA ACE barrier transactions are used for maintaining the memory ordering across a system. The learning curve to understand barrier transactions may become a barrier to verify your design thoroughly. This blog provides insight, making it easier to understand and verify the barrier transactions. The blog will cover different types of barrier transactions, usage, and domain boundaries.
MIPI DevCon 2016 was successfully held at Mountain View, California on 14-15th Sep, 2016. Synopsys MIPI protocol experts were there demonstrating our MIPI design and verification solutions for wide spectrum of markets ranging from IoT, to mobile, automotive, and consumer. During the conference Synopsys had several presentations. One of the papers presented by Synopsys was based on a customer case study that provide an overview and successful adoption of the MIPI SoundWire VIP and Test Suites to achieve comprehensive verification and coverage closure on their latest MIPI design.