VIP Central

Archive for the 'Processor Subsystems' Category

 

Bye Bye Bottlenecks – Automated SoC Performance Verification is Here!

SoC performance is a key competitive advantage in the marketplace, and the choice and configuration of protocol IP and interconnects is geared towards maximizing said performance. A case in point is the use of HBM (High Bandwidth Memory) technology and memory controllers. Currently in its third generation, HBM boasts of high-performance while using lesser power in a substantially smaller form factor than DDR. That said, how do teams ensure that the performance is delivered in the context of their SoC design?

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Posted in Automotive, Data Center, DDR, DFI, events, HBM, LPDDR, Memory, Uncategorized |

 

Latest Buzz on Next Generation Protocols

We recently published the VIP Newsletter for Jan 2018, containing trending topics, leading solutions, in depth technical articles, videos, webinars, and updates on next generation protocols. In case you missed the latest buzz on Verification IP, you can read it here.

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Posted in ACE, AMBA, Automotive, AXI, C-PHY, Camera, CHI, CSI, D-PHY, Data Center, DDR, Debug, Flash, Interconnects, LPDDR, Memory, Methodology, MIPI, Mobile SoC, NVMe, PCIe, Processor Subsystems, SPI, Storage, SystemVerilog, Test Suites, Type C, Uncategorized, UVM |

 

Industry’s First Source Code Test Suite and Verification IP for Arm AMBA ACE5 and AXI5 Enables Early Adopter Success

Synopsys offers a broad set of verification solutions for next generation Arm® AMBA® protocols, including AMBA CHI Issue B, and verification automation solutions including Auto SoC Testbench Generation and AutoPerformance for AMBA protocols, which designers have widely adopted and achieved numerous tape-out successes. We continue the rapid expansion of Synopsys’ verification solutions for AMBA protocols and strengthen our leadership with our latest offering of source code test suites and VIP for AMBA ACE5 and AXI5, which are already in use by early adopters of the new specifications.

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Posted in ACE, AMBA, AXI, CHI, Interconnects, Test Suites |

 

Backbone of Automotive Safety Systems

Safety features have always been important in the automotive industry; it has certainly become the most critical requirement for autonomous vehicles. Have you ever wondered what technology makes it possible for multiple sensors located at front, rear sections and inside the doors to work in a coordinated manner for early crash detection and operate the vehicles air bags thereby protecting precious human life?

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Posted in Automotive, SPI |

 

Next Generation Memory Technology for Graphics, Networking and HPC

In this era of revolutionary technologies, memory plays a vital role in any application that requires high-speed processing. High-resolution graphics require high-speed and high-bandwidth graphics memory, resulting in rapid adoption of next generation memory technology High-Bandwidth Memory (HBM). HBM is finding its way into leading-edge graphics, networking, HPC (High Performance Computing), and Artificial Intelligence systems; for example, decoders for a video signal, fully autonomous vehicles, neural network designs, and other advanced applications that demand low power and massive bandwidth. Our previous memory blog – Next generation memory technologies: Ready to take the verification challenges?, discussed several next generation memory technologies across applications. This blog will review the details of HBM, a next generation memory technology for graphics, networking and HPC.

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Posted in DDR, LPDDR, Memory |

 

Arm AMBA 5 AHB5: Accelerating the Embedded and IoT World

Ever since Arm released the Arm® AMBA® 5 AHB5 protocol specifications, questions have arisen among users in the design and verification community—”Why AHB5?”, “What is new in AHB5?” etc. This post initiates a short series of blogs in which we will address these questions and introduce the new features of AMBA 5 AHB5.

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Posted in AMBA, Automotive, Interconnects, Processor Subsystems, Uncategorized |

 

Higher Mobile Storage Performance at Lower System Cost

Higher storage performance at a lower cost can create a bottleneck in the design of storage devices.  In order to achieve higher performance, devices must use on chip DRAM, which adds to the overall cost. This is where Unified Memory Extension (UME), a JEDEC specification, comes into the picture. It is defined as extension to the JEDEC UFS (Universal Flash Storage) specification. JEDEC UFS device uses NAND flash technology for data storage. Unified Memory (UM) allows users to use part of the host memory as the device’s internal memory. Since the host memory is already available in large capacities, this mechanism provides a much bigger space for the device to use as a Write Buffer (WB) cache or to store information such as Logical to Physical (L2P) address translation tables. The UM area is physically located on the host side but ultimately belongs to the device, thereby replacing the device-integrated RAM, and reducing overall cost. Large space availability means the device can store larger amounts of WB of L2P table information resulting in higher storage performance.

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Posted in Automotive, eMMC, Flash, Memory, MIPI, Mobile SoC, ONFi, SPI, Storage, UFS, Uncategorized, Unipro |

 

Verification Automation Solutions for Arm AMBA Coherent Interconnects

Arm TechCon 2017 took place at Santa Clara on 24-26th Oct, 2017. This year, Synopsys’ Arm® AMBA® protocol experts were on hand to demonstrate our verification automation solutions for Arm AMBA Coherent Interconnects. Synopsys Auto SoC Testbench generation solution enables easy and quick integration and configuration of hundreds of coherent and non-coherent AMBA ports and corresponding VIP instances. Our experts also introduced our AMBA AutoPerformance solution to generate AMBA(CHI/ACE/AXI) interconnect performance verification stimulus. The AutoPerformance solution, based on Arm traffic profile specification, enables user to define traffic profiles for measurement of performance metrics like throughput, latency etc., and the stimulus is driven by VIP for AMBA (CHI/ACE/AXI).

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Posted in ACE, AMBA, Automotive, CCI400, CHI, Data Center, Interconnects, Methodology, Mobile SoC, NOC, Processor Subsystems, SystemVerilog, Test Suites, UVM |

 

First USB 3.2 VIP and TestSuite: Enhances the Verification Solution for USB IP, SoC and Type-C Subsystems

USB has literally become universal and present in every device ranging from smart phones and personal computers, IoT and wearables, storage and networking, consumer electronics and gaming consoles, automotive and many other emerging verticals. The success of USB can be attributed to innovation with each new generation—the capability to transfer data as well as supply power for charging devices and ease-of-use with a variety of connectors and form factors.

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Posted in Automotive, Data Center, Display, Flash, Mobile SoC, Storage, Type C, Uncategorized |

 

LPDDR4: The Total Package for Mobile SoC RAM

The mobile industry is growing at a very fast pace with its never-ending hunger for data and bandwidth. We have witnessed the change from a dial-pad to touch-screens, from black and white display to QHD 4k display with millions of colors, and memory space from KB to GB, in a very short span of time. The biggest challenge is increasing bandwidth without compromising performance or adding any significant numbers in the power consumption column. The solution to this challenge is the LPDDR or Mobile DDR standard released by JEDEC. There have been several revisions to this standard, the latest being LPDDR4. LPDDR4 provides a data bandwidth of 4266 Mbps, which is almost double that of LPDDR3. It also provides a significant reduction in power consumption compared to LPDDR3. For further insights on LPDDR4 and its predecessors please refer to our previous blog “LPDDR4: What Makes it Faster and Reduces Power Consumption.”

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Posted in DDR, LPDDR, Memory, Mobile SoC |