In this era of revolutionary technologies, memory plays a vital role in any application that requires high-speed processing. High-resolution graphics require high-speed and high-bandwidth graphics memory, resulting in rapid adoption of next generation memory technology High-Bandwidth Memory (HBM). HBM is finding its way into leading-edge graphics, networking, HPC (High Performance Computing), and Artificial Intelligence systems; for example, decoders for a video signal, fully autonomous vehicles, neural network designs, and other advanced applications that demand low power and massive bandwidth. Our previous memory blog – Next generation memory technologies: Ready to take the verification challenges?, discussed several next generation memory technologies across applications. This blog will review the details of HBM, a next generation memory technology for graphics, networking and HPC.
The mobile industry is growing at a very fast pace with its never-ending hunger for data and bandwidth. We have witnessed the change from a dial-pad to touch-screens, from black and white display to QHD 4k display with millions of colors, and memory space from KB to GB, in a very short span of time. The biggest challenge is increasing bandwidth without compromising performance or adding any significant numbers in the power consumption column. The solution to this challenge is the LPDDR or Mobile DDR standard released by JEDEC. There have been several revisions to this standard, the latest being LPDDR4. LPDDR4 provides a data bandwidth of 4266 Mbps, which is almost double that of LPDDR3. It also provides a significant reduction in power consumption compared to LPDDR3. For further insights on LPDDR4 and its predecessors please refer to our previous blog “LPDDR4: What Makes it Faster and Reduces Power Consumption.”
DRAM memories are the ‘heart’ of any computational device, e.g. smart phones, laptops, servers etc. LPDDR4 was mainly designed to increase memory speed and efficiency for mobile computing devices such as smartphones, tablets, and ultra-thin notebooks. It supports speeds up to 4267Mbps (double the speed of LPDDR3) and 1.1 V input/output buffer power, along with many other improvements compared to its predecessor (LPDDR3/LPDDR2). Below is a comparison of key features between all the three generations of LPDDR.
The DDR PHY Interface (DFI) is used in several consumer electronics devices including smart phones. DFI is an interface protocol that defines signals, timing, and programmable parameters required to transfer control information and data to and from the DRAM devices, and between MC (Micro Controller) and PHY. DFI is applicable to all DRAM protocols including DDR4, DDR3, DDR2, DDR, LPDDR4, LPDDR3, LPDDR2 and LPDDR.
The Design Automation Conference (DAC) 2016 was a great success and here we provide you the highlights of Synopsys’ activities at the event.
Posted in AMBA, Audio, Automotive, Camera, CAN, Data Center, DDR, Debug, DesignWare, Display, eMMC, Ethernet, Ethernet AVB, Flash, FlexRay, HBM, HMC, Interconnects, Interface Subsystems, LIN, LPDDR, Memory, Methodology, MIPI, Mobile SoC, ONFi, PCIe, Processor Subsystems, Storage, SystemVerilog, Test Suites, UFS, Uncategorized, USB, UVM
Synopsys VC VIP provides Verdi Protocol Analyzer, a protocol and memory aware debug environment . In my previous blog Debugging Memory Protocols with the Verdi Protocol Analyzer, I discussed the value add for using the Verdi Protocol Analyzer to debug memory protocols easily and efficiently. Also, I described how easy it is to look at a specific command as a transaction rather than as interpreted signals. In this blog I’m going to show another feature that makes Verdi Protocol Analyzer the tool of choice for debugging memory protocol issues and for validating proper system behavior. Furthermore, the tool can be used for verification of the command sequencer and the interaction between the DUT and the memory models. The feature, we are going to look at today, is synchronizing transactions to the corresponding signals.
Posted in AMBA, Automotive, C-PHY, CAN, CSI, D-PHY, Data Center, DDR, DesignWare, DFI, Display, DSI, eMMC, Ethernet, Ethernet AVB, Flash, HBM, HDCP, HDMI, HMC, I3C, LPDDR, Memory, Methodology, MIPI, MPHY, NVMe, ONFi, PCIe, SATA, Storage, SystemVerilog, Test Suites, UFS, Unipro, USB
My latest webinar, Keeping Pace with Memory Technology using Advanced Verification, begins by taking the audience back in time. To a time when memories had low density, slow performance, and required expensive silicon real estate. Then I fast forward back to the future when memory technologies have evolved to support huge densities, blazing fast speeds while keeping power consumption low, and all this within very small geometry.
DDR verification is one of the most critical and complex tasks in any SoC as it involves a controller sitting inside the DUT and an external DDR memory sitting outside the DUT on board. Here we will discuss fast initialization for DDR VIP models.