VIP Central

Archive for the 'Flash' Category

 

High Capacity and High Performance Flash Memory

High speed memory interface is a critical component to support high speed data in applications like personal computers, mobile phones, and digital cameras.  These applications require a high capacity and high performance NAND flash memory, and Toggle2NAND is one of the most suitable NAND interfaces. Toggle2NAND makes use of Double Data Rate (DDR) without a […]

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Posted in Automotive, eMMC, Flash, Memory, Mobile SoC, ONFi, ToggleNAND | Comments Off on High Capacity and High Performance Flash Memory

 

MIPI M-PHY 4.1 – Preventing Data Loss in High Speed Mobility Devices

In today’s world of smartphones and tablets, high speed data at low power consumption is becoming increasingly important. MIPI M-PHY supports multiple applications with high data bandwidth and low power consumption which makes it a popular specification for mobile devices. Applications like JEDEC UFS 3.0 and MIPI UniPro 1.8 now support MIPI M-PHY 4.1 which […]

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Posted in Camera, Debug, Flash, Memory, MIPI, Mobile SoC, MPHY, UFS, Unipro | Comments Off on MIPI M-PHY 4.1 – Preventing Data Loss in High Speed Mobility Devices

 

High Speed Memory in Smart Phones: MIPI UniPro v1.8 for JEDEC UFS v3.0

Flash storage is one of the most important component of a smart phone, and with every new version comes higher memory capacity and performance. The most rapidly adopted flash memory technology in recent years is Universal Flash Storage (UFS), with UFS v2.1 providing a maximum data rate of ~11Gbps. JEDEC has come up with the […]

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Posted in Automotive, eMMC, Flash, Memory, MIPI, Mobile SoC, ONFi, UFS | Comments Off on High Speed Memory in Smart Phones: MIPI UniPro v1.8 for JEDEC UFS v3.0

 

Latest Buzz on Next Generation Protocols

We recently published the VIP Newsletter for Jan 2018, containing trending topics, leading solutions, in depth technical articles, videos, webinars, and updates on next generation protocols. In case you missed the latest buzz on Verification IP, you can read it here.                     The Q1 2018 edition […]

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Posted in ACE, AMBA, Automotive, AXI, C-PHY, Camera, CHI, CSI, D-PHY, Data Center, DDR, Debug, Flash, Interconnects, LPDDR, Memory, Methodology, MIPI, Mobile SoC, NVMe, PCIe, Processor Subsystems, SPI, Storage, SystemVerilog, Test Suites, Type C, Uncategorized, UVM | Comments Off on Latest Buzz on Next Generation Protocols

 

Backbone of Automotive Safety Systems

Safety features have always been important in the automotive industry; it has certainly become the most critical requirement for autonomous vehicles. Have you ever wondered what technology makes it possible for multiple sensors located at front, rear sections and inside the doors to work in a coordinated manner for early crash detection and operate the […]

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Posted in Automotive, SPI | Comments Off on Backbone of Automotive Safety Systems

 

Higher Mobile Storage Performance at Lower System Cost

Higher storage performance at a lower cost can create a bottleneck in the design of storage devices.  In order to achieve higher performance, devices must use on chip DRAM, which adds to the overall cost. This is where Unified Memory Extension (UME), a JEDEC specification, comes into the picture. It is defined as extension to […]

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Posted in Automotive, eMMC, Flash, Memory, MIPI, Mobile SoC, ONFi, SPI, Storage, UFS, Uncategorized, Unipro | Comments Off on Higher Mobile Storage Performance at Lower System Cost

 

First USB 3.2 VIP and TestSuite: Enhances the Verification Solution for USB IP, SoC and Type-C Subsystems

USB has literally become universal and present in every device ranging from smart phones and personal computers, IoT and wearables, storage and networking, consumer electronics and gaming consoles, automotive and many other emerging verticals. The success of USB can be attributed to innovation with each new generation—the capability to transfer data as well as supply […]

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Posted in Automotive, Data Center, Display, Flash, Mobile SoC, Storage, Type C, Uncategorized | Comments Off on First USB 3.2 VIP and TestSuite: Enhances the Verification Solution for USB IP, SoC and Type-C Subsystems

 

Flavors of SPI: Emerging Protocol in Automotive

SPI interface is emerging as a popular choice in automotive applications ranging from sensors, display console, navigation systems, booting through SPI Flash and many more. SPI low pin count and configurable clock rate facilitate the requirements of the emerging automotive applications. Synchronous Serial Peripheral bus (SPI) allows synchronous serial communication between a controller and peripheral […]

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Posted in Automotive, Flash, Memory, SPI | Comments Off on Flavors of SPI: Emerging Protocol in Automotive

 

Next Generation Memory technologies: Ready to take the verification challenges?

Advancement in Memory technologies and the demand for faster and higher density configuration leaves verification engineers in a limbo. The Memory world is debating the next wave of memory protocols and technologies such as Next Generation DDR, HBM, and NVDIMM: DDR: Wishfully the next generation DDR specifications will bring many benefits to computers. With faster and […]

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Posted in Data Center, DDR, Debug, DFI, eMMC, events, Flash, HBM, HMC, LPDDR, Memory, ONFi, Storage, UFS | Comments Off on Next Generation Memory technologies: Ready to take the verification challenges?

 

eMMC: An Optimal Flash Memory

The two fundamental requirements of every mobile device is speed and power, with the biggest challenge being that both are inversely proportional to each other. One simply cannot have both, because with higher speed comes higher power consumption. With the ever increasing demand for higher resolution graphics and media to enrich the user experience, there […]

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Posted in Automotive, eMMC, Flash, Memory, Mobile SoC, Uncategorized | Comments Off on eMMC: An Optimal Flash Memory