VIP Central

Archive for the 'Flash' Category

 

NVDIMMs – A Perfect Blend of Memory and Storage

Servers are the core of today’s computational world, processing and storing data on multi-user platforms. Server performance depends on latency and capacity of its memory and storage. In general, DDR-DIMMs (Double Data Rate Dual In-line Memory Modules) are used as server memory, whereas SSDs/HDDs are used as storage in server. Whenever a service request is made to the server, it may require both data processing and storage. In order to execute this service, the processor accesses DDR-DIMMs and SSDs/HDDs. In addition, SSDs/HDDs can be accessed in case of power loss, storing data using backup power sources so data can be retrieved once power is available again.

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Posted in Flash, Memory, UVM |

 

Trending Articles on DFI 5.0 for DDR5/LPDDR5, NVMe 1.3, USB 3.2, and PCIe 5.0

We recently published the VIP Newsletter for Q3 2018, containing trending topics, leading solutions, in depth technical articles, videos, webinars, and updates on next generation protocols. The newsletter covers content on DFI 5.0 for DDR5/LPDDR5, NVMe 1.3, USB 3.2, PCIe 5.0, next generation gaming displays, MIPI CSI-2 v2.1 for Automotive and IoT, and Verdi performance analyzer and protocol debug. In case you missed the latest buzz on Verification IP, you can read it here.

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Posted in Automotive, Camera, CSI, Data Center, DDR, Debug, DFI, Display, DisplayPort, DSC, events, Flash, HDMI, LPDDR, Memory, MIPI, Mobile SoC, NVMe, PCIe, Storage, Test Suites, ToggleNAND, USB |

 

High Capacity and High Performance Flash Memory

High speed memory interface is a critical component to support high speed data in applications like personal computers, mobile phones, and digital cameras.  These applications require a high capacity and high performance NAND flash memory, and Toggle2NAND is one of the most suitable NAND interfaces.

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Posted in Automotive, eMMC, Flash, Memory, Mobile SoC, ONFi, ToggleNAND |

 

MIPI M-PHY 4.1 – Preventing Data Loss in High Speed Mobility Devices

In today’s world of smartphones and tablets, high speed data at low power consumption is becoming increasingly important. MIPI M-PHY supports multiple applications with high data bandwidth and low power consumption which makes it a popular specification for mobile devices. Applications like JEDEC UFS 3.0 and MIPI UniPro 1.8 now support MIPI M-PHY 4.1 which provides high speed data at a rate of nearly 11Gbps (HS_G4). To learn more about latest UFS and UniPro specifications read our previous blog “High Speed Memory in Smart Phones: MIPI UniPro v1.8 for JEDEC UFS v3.0”. Data at such a high speed can lead to inter-symbol-interference (ISI). M-PHY provides a safety measure to prevent the loss of data at HS_G4. In this blog, we are going to talk about the ‘ADAPT’ feature and its advantages which were introduced in M-PHY 4.0.

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Posted in Camera, Debug, Flash, Memory, MIPI, Mobile SoC, MPHY, UFS, Unipro |

 

High Speed Memory in Smart Phones: MIPI UniPro v1.8 for JEDEC UFS v3.0

Flash storage is one of the most important component of a smart phone, and with every new version comes higher memory capacity and performance. The most rapidly adopted flash memory technology in recent years is Universal Flash Storage (UFS), with UFS v2.1 providing a maximum data rate of ~11Gbps. JEDEC has come up with the faster next-generation UFS v3.0 which uses MIPI UniPro v1.8 (Unified Protocol) and MIPI M-PHY v4.1 as interconnect layer.

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Posted in Automotive, eMMC, Flash, Memory, MIPI, Mobile SoC, ONFi, UFS |

 

Latest Buzz on Next Generation Protocols

We recently published the VIP Newsletter for Jan 2018, containing trending topics, leading solutions, in depth technical articles, videos, webinars, and updates on next generation protocols. In case you missed the latest buzz on Verification IP, you can read it here.

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Posted in ACE, AMBA, Automotive, AXI, C-PHY, Camera, CHI, CSI, D-PHY, Data Center, DDR, Debug, Flash, Interconnects, LPDDR, Memory, Methodology, MIPI, Mobile SoC, NVMe, PCIe, Processor Subsystems, SPI, Storage, SystemVerilog, Test Suites, Type C, Uncategorized, UVM |

 

Backbone of Automotive Safety Systems

Safety features have always been important in the automotive industry; it has certainly become the most critical requirement for autonomous vehicles. Have you ever wondered what technology makes it possible for multiple sensors located at front, rear sections and inside the doors to work in a coordinated manner for early crash detection and operate the vehicles air bags thereby protecting precious human life?

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Posted in Automotive, SPI |

 

Higher Mobile Storage Performance at Lower System Cost

Higher storage performance at a lower cost can create a bottleneck in the design of storage devices.  In order to achieve higher performance, devices must use on chip DRAM, which adds to the overall cost. This is where Unified Memory Extension (UME), a JEDEC specification, comes into the picture. It is defined as extension to the JEDEC UFS (Universal Flash Storage) specification. JEDEC UFS device uses NAND flash technology for data storage. Unified Memory (UM) allows users to use part of the host memory as the device’s internal memory. Since the host memory is already available in large capacities, this mechanism provides a much bigger space for the device to use as a Write Buffer (WB) cache or to store information such as Logical to Physical (L2P) address translation tables. The UM area is physically located on the host side but ultimately belongs to the device, thereby replacing the device-integrated RAM, and reducing overall cost. Large space availability means the device can store larger amounts of WB of L2P table information resulting in higher storage performance.

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Posted in Automotive, eMMC, Flash, Memory, MIPI, Mobile SoC, ONFi, SPI, Storage, UFS, Uncategorized, Unipro |

 

First USB 3.2 VIP and TestSuite: Enhances the Verification Solution for USB IP, SoC and Type-C Subsystems

USB has literally become universal and present in every device ranging from smart phones and personal computers, IoT and wearables, storage and networking, consumer electronics and gaming consoles, automotive and many other emerging verticals. The success of USB can be attributed to innovation with each new generation—the capability to transfer data as well as supply power for charging devices and ease-of-use with a variety of connectors and form factors.

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Posted in Automotive, Data Center, Display, Flash, Mobile SoC, Storage, Type C, Uncategorized |

 

Flavors of SPI: Emerging Protocol in Automotive

SPI interface is emerging as a popular choice in automotive applications ranging from sensors, display console, navigation systems, booting through SPI Flash and many more. SPI low pin count and configurable clock rate facilitate the requirements of the emerging automotive applications.

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Posted in Automotive, Flash, Memory, SPI |