In this blog we will review the newest features released as part of the Arm® AMBA® ACE5-Lite protocol, said to improve throughput and meet the low power demands of ever evolving complex multicore SoCs including cache coherency.
Arm recently announced the availability of the next iteration of the Arm® AMBA® 5 CHI protocol – CHI Issue F (CHI-F). AMBA 5 CHI-F is built on top of the existing AMBA CHI Issue E (CHI-E) specification (read our blog on AMBA CHI-E here), and introduces several exciting features related to the latest Arm architecture and optimized transaction flows.
Posted in AMBA, Arm, CHI, Data Center, Interconnects, Protocol Continuum, Test Suites
Data is the new fuel powering critical use-cases for cloud /edge computing, and advances in AI. All aspects of data handling – gathering, storing, moving, processing, and dispersing – pose unique design implementation and verification challenges. The need for heterogenous computing has given exponential rise to application specific accelerators, pushing the industry to come up with a solution for efficient data handling and resource utilization. CXL is a processor interconnect protocol designed to support high bandwidth, low-latency interface from CPU to workload accelerators, maintaining memory coherency across heterogeneous devices, while addressing security needs of the user.
Posted in CXL, Data Center, Interconnects, PCIe, Protocol Continuum
Arm TechCon was successfully held at San Jose Convention Center on 8-10th October, 2019. Synopsys protocol experts were there demonstrating our verification solutions for attendees from a wide spectrum of markets like IoT, mobile, automotive, and consumer.
Posted in AMBA, Interconnects, Mobile SoC, Processor Subsystems, Uncategorized
As Data Center and Artificial Intelligence applications take center stage , last few years have seen the advent of various high bandwidth interconnect technologies. Compute Express Link (CXL), is an aspiring new interconnect technology for high bandwidth devices such as accelerators with memory, high density compute cards, and GPU comprised accelerators. The specification is defined by CXL Consortium https://www.computeexpresslink.org/. Synopsys has developed a comprehensive CXL verification subsystem, being already used by Early Adopters planning to release their first CXL applications. CXL verification subsystem leverages industry popular Synopsys PCI Express Verification IP. Synopsys recently introduced Industry’s first CXL IP solution. For more details refer Synopsys Delivers Industry’s First Compute Express Link (CXL) IP Solution for Breakthrough Performance in Data-Intensive SoCs.
Posted in CXL, DesignWare, Interconnects, Mobile SoC, PCIe
We recently published the VIP Newsletter for Q4 2018, containing trending topics, leading solutions, in depth technical articles, videos, webinars, and updates on next generation protocols. The newsletter covers content on PCIe 5.0, Arm® AMBA® 5 ACE5 and AXI5, CCIX and next generation MIPI and display protocols and applications ranging from AI, Cloud, Display, Storage and Networking. In case you missed the latest buzz on Verification IP, you can read it here.
Posted in ACE, AMBA, Audio, Automotive, AXI, Camera, CCIX, CHI, Data Center, Debug, DesignWare, Display, events, HDCP, HDMI, Interconnects, Interface Subsystems, MIPI, Mobile SoC, MPHY, PCIe, Processor Subsystems, Soundwire, Storage, Test Suites, Uncategorized
Next generation SoC designs require faster coherent interconnects for high performance applications such as machine learning, network processing, storage off-load, in-memory data base and 4G/5G wireless technology. CCIX (Cache Coherent Interconnect for Accelerators), a new protocol standard, provides benefits of cache coherency and peer processing which enables the faster interconnect. CCIX is designed smartly to use the well-established PCIe infrastructure to carry coherency packets across the link with little modification. CCIX specification is compatible with PCIe base specification 4.0. PCIe implementation is extended to implement a CCIX transaction layer, responsible for carrying the coherency messages.
Posted in CCIX, CHI, Data Center, Interconnects, PCIe, Storage
We recently published the VIP Newsletter for Jan 2018, containing trending topics, leading solutions, in depth technical articles, videos, webinars, and updates on next generation protocols. In case you missed the latest buzz on Verification IP, you can read it here.
Posted in ACE, AMBA, Automotive, AXI, C-PHY, Camera, CHI, CSI, D-PHY, Data Center, DDR, Debug, Flash, Interconnects, LPDDR, Memory, Methodology, MIPI, Mobile SoC, NVMe, PCIe, Processor Subsystems, SPI, Storage, SystemVerilog, Test Suites, Type C, Uncategorized, UVM
Synopsys offers a broad set of verification solutions for next generation Arm® AMBA® protocols, including AMBA CHI Issue B, and verification automation solutions including Auto SoC Testbench Generation and AutoPerformance for AMBA protocols, which designers have widely adopted and achieved numerous tape-out successes. We continue the rapid expansion of Synopsys’ verification solutions for AMBA protocols and strengthen our leadership with our latest offering of source code test suites and VIP for AMBA ACE5 and AXI5, which are already in use by early adopters of the new specifications.
Posted in ACE, AMBA, AXI, CHI, Interconnects, Test Suites
Ever since Arm released the Arm® AMBA® 5 AHB5 protocol specifications, questions have arisen among users in the design and verification community—”Why AHB5?”, “What is new in AHB5?” etc. This post initiates a short series of blogs in which we will address these questions and introduce the new features of AMBA 5 AHB5.
Posted in AMBA, Automotive, Interconnects, Processor Subsystems, Uncategorized
