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Archive for the 'Processor Subsystems' Category

 

LPDDR4: What Makes It Faster and Reduces Power Consumption

DRAM memories are the ‘heart’ of any computational device, e.g. smart phones, laptops, servers etc. LPDDR4 was mainly designed to increase memory speed and efficiency for mobile computing devices such as smartphones, tablets, and ultra-thin notebooks.  It supports speeds up to 4267Mbps (double the speed of LPDDR3) and 1.1 V input/output buffer power, along with […]

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Posted in Automotive, Data Center, DDR, DFI, LPDDR, Memory, Mobile SoC | No Comments »

 

Flavors of SPI: Emerging Protocol in Automotive

SPI interface is emerging as a popular choice in automotive applications ranging from sensors, display console, navigation systems, booting through SPI Flash and many more. SPI low pin count and configurable clock rate facilitate the requirements of the emerging automotive applications. Synchronous Serial Peripheral bus (SPI) allows synchronous serial communication between a controller and peripheral […]

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Posted in Automotive, Flash, Memory, SPI | No Comments »

 

SoC Leaders Verify with Synopsys: Watch it Now

Synopsys hosted the annual Verification Luncheon and Customer Panel – SoC Leaders Verify with Synopsys at DAC 2017 in Austin, Texas. The panel featured industry experts and executives from Intel, Qualcomm, AMD, NXP, and Wave Computing, and drove our main messages of innovation and technology leadership, in addition to collaborations with market makers. In case you missed it, […]

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Posted in ACE, AMBA, CCI400, CHI, events, Interconects | Comments Off on SoC Leaders Verify with Synopsys: Watch it Now

 

Rapid Adoption of Synopsys VIP for ARM AMBA 5 CHI

There was a time when coherent multi-processor systems were a niche technology with complex proprietary architectures. With ever increasing demand for performance, coherent systems with multiple processors and coherent accelerators are now being adopted rapidly across applications and market segments ranging from infrastructure networking and servers to storage and automotive. ARM® AMBA® 5 CHI provides […]

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Posted in ACE, AMBA, CCI400, CHI, Interconects, NOC, Processor Subsystems | Comments Off on Rapid Adoption of Synopsys VIP for ARM AMBA 5 CHI

 

Latest Buzz in Verification IP

    We recently released the Q2 VIP newsletter containing trending topics, leading solutions, in depth technical articles, videos, webinars and product announcements from VIP and protocol experts. In case you missed the latest buzz on Verification IP, you can read it here.                         […]

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Posted in ACE, AMBA, Automotive, CAN, CCI400, CHI, Data Center, Display, DisplayPort, eMMC, Ethernet AVB, FlexRay, HDCP, Interconects, JESD, LIN, MIPI, PCIe, Processor Subsystems, UFS | Comments Off on Latest Buzz in Verification IP

 

Jumping the Barrier of Verifying AMBA ACE Barrier Transactions

The ordering of memory transactions in AMBA protocol is a significant requirement, i.e. the sequence of memory updates/accesses must follow a defined ordering as per the specification. Ordering is important for synchronization events by a processor with respect to retiring load/store instructions. AMBA ACE barrier transactions are used for maintaining the memory ordering across a […]

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Posted in ACE, AMBA, CCI400, CHI, Interconects, Test Suites, Uncategorized | Comments Off on Jumping the Barrier of Verifying AMBA ACE Barrier Transactions

 

Next Generation Memory technologies: Ready to take the verification challenges?

Advancement in Memory technologies and the demand for faster and higher density configuration leaves verification engineers in a limbo. The Memory world is debating the next wave of memory protocols and technologies such as Next Generation DDR, HBM, and NVDIMM: DDR: Wishfully the next generation DDR specifications will bring many benefits to computers. With faster and […]

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Posted in Data Center, DDR, Debug, DFI, eMMC, events, Flash, HBM, HMC, LPDDR, Memory, ONFi, Storage, UFS | Comments Off on Next Generation Memory technologies: Ready to take the verification challenges?

 

eMMC: An Optimal Flash Memory

The two fundamental requirements of every mobile device is speed and power, with the biggest challenge being that both are inversely proportional to each other. One simply cannot have both, because with higher speed comes higher power consumption. With the ever increasing demand for higher resolution graphics and media to enrich the user experience, there […]

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Posted in Automotive, eMMC, Flash, Memory, Mobile SoC, Uncategorized | Comments Off on eMMC: An Optimal Flash Memory

 

DDR-PHY Interoperability Using DFI

The DDR PHY Interface (DFI) is used in several consumer electronics devices including smart phones. DFI is an interface protocol that defines signals, timing, and programmable parameters required to transfer control information and data to and from the DRAM devices, and between MC (Micro Controller) and PHY. DFI is applicable to all DRAM protocols including […]

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Posted in DDR, DFI, LPDDR, Uncategorized | Comments Off on DDR-PHY Interoperability Using DFI

 

UFS – Faster and Secured Flash Storage

In today’s connected world of smart devices, we want to access our data faster and at the same time we want it to be secured and protected from intruders. Flash memories are not only faster but secured and reliable also in its avatar as UFS – Universal Flash Storage. This blog provides an insight into […]

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Posted in Flash, Memory, MIPI, UFS, Unipro | Comments Off on UFS – Faster and Secured Flash Storage