VIP Central

Archive for the 'Processor Subsystems' Category

 

Latest In-depth Technical Articles and Videos on PCIe 5.0, AMBA 5, and CCIX

We recently published the VIP Newsletter for Q4 2018, containing trending topics, leading solutions, in depth technical articles, videos, webinars, and updates on next generation protocols. The newsletter covers content on PCIe 5.0, Arm® AMBA® 5 ACE5 and AXI5, CCIX and next generation MIPI and display protocols  and applications ranging from AI, Cloud, Display, Storage and […]

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Posted in ACE, AMBA, Audio, Automotive, AXI, Camera, CCIX, CHI, Data Center, Debug, DesignWare, Display, events, HDCP, HDMI, Interconnects, Interface Subsystems, MIPI, Mobile SoC, MPHY, PCIe, Processor Subsystems, Soundwire, Storage, Test Suites, Uncategorized | Comments Off on Latest In-depth Technical Articles and Videos on PCIe 5.0, AMBA 5, and CCIX

 

CCIX Over PCIe: Faster Coherent Interconnects for AI, Networking, 4G/5G, and Storage Designs

Next generation SoC designs require faster coherent interconnects for high performance applications such as machine learning, network processing, storage off-load, in-memory data base and 4G/5G wireless technology. CCIX (Cache Coherent Interconnect for Accelerators), a new protocol standard, provides benefits of cache coherency and peer processing which enables the faster interconnect. CCIX is designed smartly to […]

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Posted in CCIX, CHI, Data Center, Interconnects, PCIe, Storage | Comments Off on CCIX Over PCIe: Faster Coherent Interconnects for AI, Networking, 4G/5G, and Storage Designs

 

Trending Articles on DFI 5.0 for DDR5/LPDDR5, NVMe 1.3, USB 3.2, and PCIe 5.0

We recently published the VIP Newsletter for Q3 2018, containing trending topics, leading solutions, in depth technical articles, videos, webinars, and updates on next generation protocols. The newsletter covers content on DFI 5.0 for DDR5/LPDDR5, NVMe 1.3, USB 3.2, PCIe 5.0, next generation gaming displays, MIPI CSI-2 v2.1 for Automotive and IoT, and Verdi performance […]

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Posted in Automotive, Camera, CSI, Data Center, DDR, Debug, DFI, Display, DisplayPort, DSC, events, Flash, HDMI, LPDDR, Memory, MIPI, Mobile SoC, NVMe, PCIe, Storage, Test Suites, ToggleNAND, USB | Comments Off on Trending Articles on DFI 5.0 for DDR5/LPDDR5, NVMe 1.3, USB 3.2, and PCIe 5.0

 

How DFI 5.0 Ensures Higher Performance in DDR5/LPDDR5 Systems?

The growth of datacenter, storage, automotive and other emerging market applications is driving the development of next-generation memory technologies – DDR5, LPDDR5. Like their predecessors, the latest memory technologies also use DFI, a standard interface between memory controller and PHY, to reduce the integration cost and increase performance and data throughput efficiency. DFI also has […]

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Posted in Automotive, Data Center, DDR, DFI, LPDDR, Memory, Storage | Comments Off on How DFI 5.0 Ensures Higher Performance in DDR5/LPDDR5 Systems?

 

High Capacity and High Performance Flash Memory

High speed memory interface is a critical component to support high speed data in applications like personal computers, mobile phones, and digital cameras.  These applications require a high capacity and high performance NAND flash memory, and Toggle2NAND is one of the most suitable NAND interfaces. Toggle2NAND makes use of Double Data Rate (DDR) without a […]

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Posted in Automotive, eMMC, Flash, Memory, Mobile SoC, ONFi, ToggleNAND | Comments Off on High Capacity and High Performance Flash Memory

 

MIPI M-PHY 4.1 – Preventing Data Loss in High Speed Mobility Devices

In today’s world of smartphones and tablets, high speed data at low power consumption is becoming increasingly important. MIPI M-PHY supports multiple applications with high data bandwidth and low power consumption which makes it a popular specification for mobile devices. Applications like JEDEC UFS 3.0 and MIPI UniPro 1.8 now support MIPI M-PHY 4.1 which […]

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Posted in Camera, Debug, Flash, Memory, MIPI, Mobile SoC, MPHY, UFS, Unipro | Comments Off on MIPI M-PHY 4.1 – Preventing Data Loss in High Speed Mobility Devices

 

High Speed Memory in Smart Phones: MIPI UniPro v1.8 for JEDEC UFS v3.0

Flash storage is one of the most important component of a smart phone, and with every new version comes higher memory capacity and performance. The most rapidly adopted flash memory technology in recent years is Universal Flash Storage (UFS), with UFS v2.1 providing a maximum data rate of ~11Gbps. JEDEC has come up with the […]

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Posted in Automotive, eMMC, Flash, Memory, MIPI, Mobile SoC, ONFi, UFS | Comments Off on High Speed Memory in Smart Phones: MIPI UniPro v1.8 for JEDEC UFS v3.0

 

LPDDR5: Enhancements in Bandwidth, Reliability, and Power for IoT, AI, and Image Processing

New applications like Cloud Computing, Artificial Intelligence, Autonomous cars, Augmented reality, Embedded vision are driving stricter requirements around memory performance and power efficiency.  Memory is central to these systems, that require high bandwidth and speed along with lower power and lower cost. With these emerging market needs, the memory industry started to move from planar […]

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Posted in Automotive, Camera, DDR, DFI, Display, HBM, HMC, LPDDR, Memory, Mobile SoC | Comments Off on LPDDR5: Enhancements in Bandwidth, Reliability, and Power for IoT, AI, and Image Processing

 

Bye Bye Bottlenecks – Automated SoC Performance Verification is Here!

SoC performance is a key competitive advantage in the marketplace, and the choice and configuration of protocol IP and interconnects is geared towards maximizing said performance. A case in point is the use of HBM (High Bandwidth Memory) technology and memory controllers. Currently in its third generation, HBM boasts of high-performance while using lesser power […]

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Posted in Automotive, Data Center, DDR, DFI, events, HBM, LPDDR, Memory, Uncategorized | Comments Off on Bye Bye Bottlenecks – Automated SoC Performance Verification is Here!

 

Latest Buzz on Next Generation Protocols

We recently published the VIP Newsletter for Jan 2018, containing trending topics, leading solutions, in depth technical articles, videos, webinars, and updates on next generation protocols. In case you missed the latest buzz on Verification IP, you can read it here.                     The Q1 2018 edition […]

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Posted in ACE, AMBA, Automotive, AXI, C-PHY, Camera, CHI, CSI, D-PHY, Data Center, DDR, Debug, Flash, Interconnects, LPDDR, Memory, Methodology, MIPI, Mobile SoC, NVMe, PCIe, Processor Subsystems, SPI, Storage, SystemVerilog, Test Suites, Type C, Uncategorized, UVM | Comments Off on Latest Buzz on Next Generation Protocols