VIP Central

Archive for the 'MIPI' Category

 

MIPI CSI-2 v3.0 is here! – The industry’s First Comprehensive Solution for 5G, Imaging, Surveillance and Automotive

Smartphones have become a one-man army by incorporating fancy features like biometric authentication, telemedicine, heartrate monitoring. With increasing market demands and requirements for higher image resolutions, MIPI CSI-2 (Camera Serial Interface) has evolved tenfold from where it first started. MIPI CSI-2 v2.0 is designed for use in smartphones, Internet of Things (IoT) devices, wearables, medical devices, augmented and virtual reality. MIPI Board recently adopted MIPI CSI-2 Specification v3.0 and approved associated CTS documents, refer https://members.mipi.org/wg/All-members/document/download/79549.

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Posted in 5G, Automotive, C-PHY, Camera, CSI, MIPI, Mobile SoC, MPHY |

 

Latest In-depth Technical Articles and Videos on PCIe 5.0, AMBA 5, and CCIX

We recently published the VIP Newsletter for Q4 2018, containing trending topics, leading solutions, in depth technical articles, videos, webinars, and updates on next generation protocols. The newsletter covers content on PCIe 5.0, Arm® AMBA® 5 ACE5 and AXI5, CCIX and next generation MIPI and display protocols  and applications ranging from AI, Cloud, Display, Storage and Networking. In case you missed the latest buzz on Verification IP, you can read it here.

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Posted in ACE, AMBA, Audio, Automotive, AXI, Camera, CCIX, CHI, Data Center, Debug, DesignWare, Display, events, HDCP, HDMI, Interconnects, Interface Subsystems, MIPI, Mobile SoC, MPHY, PCIe, Processor Subsystems, Soundwire, Storage, Test Suites, Uncategorized |

 

Trending Articles on DFI 5.0 for DDR5/LPDDR5, NVMe 1.3, USB 3.2, and PCIe 5.0

We recently published the VIP Newsletter for Q3 2018, containing trending topics, leading solutions, in depth technical articles, videos, webinars, and updates on next generation protocols. The newsletter covers content on DFI 5.0 for DDR5/LPDDR5, NVMe 1.3, USB 3.2, PCIe 5.0, next generation gaming displays, MIPI CSI-2 v2.1 for Automotive and IoT, and Verdi performance analyzer and protocol debug. In case you missed the latest buzz on Verification IP, you can read it here.

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Posted in Automotive, Camera, CSI, Data Center, DDR, Debug, DFI, Display, DisplayPort, DSC, events, Flash, HDMI, LPDDR, Memory, MIPI, Mobile SoC, NVMe, PCIe, Storage, Test Suites, ToggleNAND, USB |

 

MIPI M-PHY 4.1 – Preventing Data Loss in High Speed Mobility Devices

In today’s world of smartphones and tablets, high speed data at low power consumption is becoming increasingly important. MIPI M-PHY supports multiple applications with high data bandwidth and low power consumption which makes it a popular specification for mobile devices. Applications like JEDEC UFS 3.0 and MIPI UniPro 1.8 now support MIPI M-PHY 4.1 which provides high speed data at a rate of nearly 11Gbps (HS_G4). To learn more about latest UFS and UniPro specifications read our previous blog “High Speed Memory in Smart Phones: MIPI UniPro v1.8 for JEDEC UFS v3.0”. Data at such a high speed can lead to inter-symbol-interference (ISI). M-PHY provides a safety measure to prevent the loss of data at HS_G4. In this blog, we are going to talk about the ‘ADAPT’ feature and its advantages which were introduced in M-PHY 4.0.

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Posted in Camera, Debug, Flash, Memory, MIPI, Mobile SoC, MPHY, UFS, Unipro |

 

High Speed Memory in Smart Phones: MIPI UniPro v1.8 for JEDEC UFS v3.0

Flash storage is one of the most important component of a smart phone, and with every new version comes higher memory capacity and performance. The most rapidly adopted flash memory technology in recent years is Universal Flash Storage (UFS), with UFS v2.1 providing a maximum data rate of ~11Gbps. JEDEC has come up with the faster next-generation UFS v3.0 which uses MIPI UniPro v1.8 (Unified Protocol) and MIPI M-PHY v4.1 as interconnect layer.

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Posted in Automotive, eMMC, Flash, Memory, MIPI, Mobile SoC, ONFi, UFS |

 

Beyond Mobility, MIPI CSI-2 v2.1 now in Automotive, Drones and IoT

One could argue that camera has been the most fascinating feature of smart phones in recent years. The latest camera phones are capable of not only capturing minute details with multi-mega pixels, but also sensing the presence of various objects. MIPI CSI-2 (Camera Serial Interface) is a high-bandwidth interface between a camera and a host processor. MIPI CSI-2 v1.1 got introduced in 2011 to fulfill the basic camera requirements of mobile applications. Next generation MIPI CSI-2 v2.0 and v2.1 have evolved to meet the requirements of emerging imaging and vision applications like wearables, IoT, drones, automotive, and security surveillance beyond smart phones. Read our previous blog to know more about MIPI CSI-2 v2.0: Emerging Applications in IoT, Drones and Automotive. The new features of MIPI CSI-2 v2.1 are outlined below:

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Posted in Automotive, C-PHY, Camera, CSI, D-PHY, Interface Subsystems, MIPI, Mobile SoC |

 

Latest Buzz on Next Generation Protocols

We recently published the VIP Newsletter for Jan 2018, containing trending topics, leading solutions, in depth technical articles, videos, webinars, and updates on next generation protocols. In case you missed the latest buzz on Verification IP, you can read it here.

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Posted in ACE, AMBA, Automotive, AXI, C-PHY, Camera, CHI, CSI, D-PHY, Data Center, DDR, Debug, Flash, Interconnects, LPDDR, Memory, Methodology, MIPI, Mobile SoC, NVMe, PCIe, Processor Subsystems, SPI, Storage, SystemVerilog, Test Suites, Type C, Uncategorized, UVM |

 

MIPI Solutions for Automotive, IoT and Mixed Reality

This year, MIPI DevCon was held in Bangalore, India and Hsinchu City, Taiwan in October. Synopsys MIPI protocol experts hosted several demos at each conference showcasing implementation experiences, use cases and application examples within mobile, automotive, IoT and mixed reality applications.

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Posted in Audio, Automotive, C-PHY, Camera, CSI, D-PHY, I2S, I3C, Interface Subsystems, MIPI, Mobile SoC, MPHY, SlimBus, Soundwire, Unipro |

 

Higher Mobile Storage Performance at Lower System Cost

Higher storage performance at a lower cost can create a bottleneck in the design of storage devices.  In order to achieve higher performance, devices must use on chip DRAM, which adds to the overall cost. This is where Unified Memory Extension (UME), a JEDEC specification, comes into the picture. It is defined as extension to the JEDEC UFS (Universal Flash Storage) specification. JEDEC UFS device uses NAND flash technology for data storage. Unified Memory (UM) allows users to use part of the host memory as the device’s internal memory. Since the host memory is already available in large capacities, this mechanism provides a much bigger space for the device to use as a Write Buffer (WB) cache or to store information such as Logical to Physical (L2P) address translation tables. The UM area is physically located on the host side but ultimately belongs to the device, thereby replacing the device-integrated RAM, and reducing overall cost. Large space availability means the device can store larger amounts of WB of L2P table information resulting in higher storage performance.

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Posted in Automotive, eMMC, Flash, Memory, MIPI, Mobile SoC, ONFi, SPI, Storage, UFS, Uncategorized, Unipro |

 

MIPI CSI-2 v2.0: Emerging Applications in IoT, Drones and Automotive

MIPI Camera Serial Interface (CSI-2) is widely used as a camera interface in the mobile industry. MIPI Alliance is constantly working towards providing a solution to cater the increasing demand for higher-bandwidth and high-definition video like 1080p, 4K, and 8K. The MIPI Working Group released CSI-2 v2.0 to target emerging imaging and vision applications. It has extended the usages of CSI-2 to IoT, wearable devices, drones, Virtual Reality (VR) and Augmented Reality (AR), and automotive systems.

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Posted in Automotive, C-PHY, Camera, CSI, D-PHY, Interface Subsystems, MIPI, Mobile SoC |