Smartphones have become a one-man army by incorporating fancy features like biometric authentication, telemedicine, heartrate monitoring. With increasing market demands and requirements for higher image resolutions, MIPI CSI-2 (Camera Serial Interface) has evolved tenfold from where it first started. MIPI CSI-2 v2.0 is designed for use in smartphones, Internet of Things (IoT) devices, wearables, medical devices, augmented and virtual reality. MIPI Board recently adopted MIPI CSI-2 Specification v3.0 and approved associated CTS documents, refer https://members.mipi.org/wg/All-members/document/download/79549.
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Posted in 5G, Automotive, C-PHY, Camera, CSI, MIPI, Mobile SoC, MPHY
We recently published the VIP Newsletter for Q4 2018, containing trending topics, leading solutions, in depth technical articles, videos, webinars, and updates on next generation protocols. The newsletter covers content on PCIe 5.0, Arm® AMBA® 5 ACE5 and AXI5, CCIX and next generation MIPI and display protocols and applications ranging from AI, Cloud, Display, Storage and Networking. In case you missed the latest buzz on Verification IP, you can read it here.
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Posted in ACE, AMBA, Audio, Automotive, AXI, Camera, CCIX, CHI, Data Center, Debug, DesignWare, Display, events, HDCP, HDMI, Interconnects, Interface Subsystems, MIPI, Mobile SoC, MPHY, PCIe, Processor Subsystems, Soundwire, Storage, Test Suites, Uncategorized
In today’s world of smartphones and tablets, high speed data at low power consumption is becoming increasingly important. MIPI M-PHY supports multiple applications with high data bandwidth and low power consumption which makes it a popular specification for mobile devices. Applications like JEDEC UFS 3.0 and MIPI UniPro 1.8 now support MIPI M-PHY 4.1 which provides high speed data at a rate of nearly 11Gbps (HS_G4). To learn more about latest UFS and UniPro specifications read our previous blog “High Speed Memory in Smart Phones: MIPI UniPro v1.8 for JEDEC UFS v3.0”. Data at such a high speed can lead to inter-symbol-interference (ISI). M-PHY provides a safety measure to prevent the loss of data at HS_G4. In this blog, we are going to talk about the ‘ADAPT’ feature and its advantages which were introduced in M-PHY 4.0.
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Posted in Camera, Debug, Flash, Memory, MIPI, Mobile SoC, MPHY, UFS, Unipro
This year, MIPI DevCon was held in Bangalore, India and Hsinchu City, Taiwan in October. Synopsys MIPI protocol experts hosted several demos at each conference showcasing implementation experiences, use cases and application examples within mobile, automotive, IoT and mixed reality applications.
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Posted in Audio, Automotive, C-PHY, Camera, CSI, D-PHY, I2S, I3C, Interface Subsystems, MIPI, Mobile SoC, MPHY, SlimBus, Soundwire, Unipro
If you are currently using or consider using JEDEC UFS protocol in your next design you might face several verification challenges. The following blog will talk about 7 of the biggest challenges of UFS stack verification. With the fact that people are moving to reduced pin count and increased speed, an MPHY based stack has picked up momentum and provides an increased number of new applications to leverage the UFS stack. The UFS protocol is being adopted rapidly due to its higher performance, efficiency, concurrent multi-tasking, usage of the complete band width, security, and reliability and longer power life.
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Posted in Mobile SoC, MPHY, UFS, Unipro
MIPI DevCon 2016 was successfully held at Mountain View, California on 14-15th Sep, 2016. Synopsys MIPI protocol experts were there demonstrating our MIPI design and verification solutions for wide spectrum of markets ranging from IoT, to mobile, automotive, and consumer. During the conference Synopsys had several presentations. One of the papers presented by Synopsys was based on a customer case study that provide an overview and successful adoption of the MIPI SoundWire VIP and Test Suites to achieve comprehensive verification and coverage closure on their latest MIPI design.
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Posted in Audio, Automotive, C-PHY, Camera, CSI, D-PHY, events, I2S, I3C, Interface Subsystems, MIPI, Mobile SoC, MPHY, SlimBus, Soundwire, Test Suites, UFS, Unipro
Getting the best out of available battery technologies continues to be a challenge for mobile design companies. When phones were used for voice only, the battery lasted a few days compared to less than a day in case of smartphones with high resolution screens, cameras, powerful processors, gigabytes of memories and running power hungry software. Consumers continuously demand more features and functions from their mobile electronics and with more functions converged into a single device, it’s becoming extremely challenging for SoC designs to keep up with the exploding bandwidth, advanced integration functionality and low power constraints.
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Posted in Camera, CSI, D-PHY, DSI, Mobile SoC, MPHY, Uncategorized, Unipro
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Posted in AMBA, Automotive, C-PHY, CAN, CSI, D-PHY, Data Center, DDR, DesignWare, DFI, Display, DSI, eMMC, Ethernet, Ethernet AVB, Flash, HBM, HDCP, HDMI, HMC, I3C, LPDDR, Memory, Methodology, MIPI, MPHY, NVMe, ONFi, PCIe, SATA, Storage, SystemVerilog, Test Suites, UFS, Unipro, USB
MIPI UniPro is a recent addition to mobile chip-to-chip interconnect technology. It’s got many useful features to meet the requirements of mobile applications. That’s perhaps why Google’s Project Ara has selected MIPI UniPro and MIPI M-PHY as its backbone interconnects.
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Posted in Methodology, MIPI, Mobile SoC, MPHY, Unipro
Internet of Things (IoT) is connecting billions of intelligent “things” to our fingertips. The ability to sense countless amounts of information that communicates to the cloud is driving innovation into IoT applications. Servers powering the cloud will have to scale to handle these billions of intelligent things. As a preparation to that PCIe Gen 4 has been introduced. It is capable of supporting 16 T transfers/s. Current primary market driver for the PCIe Gen4 application seems to be server storage space.
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Posted in Debug, Methodology, MIPI, MPHY, PCIe, SystemVerilog
