VIP Central

Archive for the 'CSI' Category

 

Trending Articles on DFI 5.0 for DDR5/LPDDR5, NVMe 1.3, USB 3.2, and PCIe 5.0

We recently published the VIP Newsletter for Q3 2018, containing trending topics, leading solutions, in depth technical articles, videos, webinars, and updates on next generation protocols. The newsletter covers content on DFI 5.0 for DDR5/LPDDR5, NVMe 1.3, USB 3.2, PCIe 5.0, next generation gaming displays, MIPI CSI-2 v2.1 for Automotive and IoT, and Verdi performance analyzer and protocol debug. In case you missed the latest buzz on Verification IP, you can read it here.

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Posted in Automotive, Camera, CSI, Data Center, DDR, Debug, DFI, Display, DisplayPort, DSC, events, Flash, HDMI, LPDDR, Memory, MIPI, Mobile SoC, NVMe, PCIe, Storage, Test Suites, ToggleNAND, USB |

 

Beyond Mobility, MIPI CSI-2 v2.1 now in Automotive, Drones and IoT

One could argue that camera has been the most fascinating feature of smart phones in recent years. The latest camera phones are capable of not only capturing minute details with multi-mega pixels, but also sensing the presence of various objects. MIPI CSI-2 (Camera Serial Interface) is a high-bandwidth interface between a camera and a host processor. MIPI CSI-2 v1.1 got introduced in 2011 to fulfill the basic camera requirements of mobile applications. Next generation MIPI CSI-2 v2.0 and v2.1 have evolved to meet the requirements of emerging imaging and vision applications like wearables, IoT, drones, automotive, and security surveillance beyond smart phones. Read our previous blog to know more about MIPI CSI-2 v2.0: Emerging Applications in IoT, Drones and Automotive. The new features of MIPI CSI-2 v2.1 are outlined below:

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Posted in Automotive, C-PHY, Camera, CSI, D-PHY, Interface Subsystems, MIPI, Mobile SoC |

 

Latest Buzz on Next Generation Protocols

We recently published the VIP Newsletter for Jan 2018, containing trending topics, leading solutions, in depth technical articles, videos, webinars, and updates on next generation protocols. In case you missed the latest buzz on Verification IP, you can read it here.

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Posted in ACE, AMBA, Automotive, AXI, C-PHY, Camera, CHI, CSI, D-PHY, Data Center, DDR, Debug, Flash, Interconnects, LPDDR, Memory, Methodology, MIPI, Mobile SoC, NVMe, PCIe, Processor Subsystems, SPI, Storage, SystemVerilog, Test Suites, Type C, Uncategorized, UVM |

 

MIPI Solutions for Automotive, IoT and Mixed Reality

This year, MIPI DevCon was held in Bangalore, India and Hsinchu City, Taiwan in October. Synopsys MIPI protocol experts hosted several demos at each conference showcasing implementation experiences, use cases and application examples within mobile, automotive, IoT and mixed reality applications.

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Posted in Audio, Automotive, C-PHY, Camera, CSI, D-PHY, I2S, I3C, Interface Subsystems, MIPI, Mobile SoC, MPHY, SlimBus, Soundwire, Unipro |

 

MIPI CSI-2 v2.0: Emerging Applications in IoT, Drones and Automotive

MIPI Camera Serial Interface (CSI-2) is widely used as a camera interface in the mobile industry. MIPI Alliance is constantly working towards providing a solution to cater the increasing demand for higher-bandwidth and high-definition video like 1080p, 4K, and 8K. The MIPI Working Group released CSI-2 v2.0 to target emerging imaging and vision applications. It has extended the usages of CSI-2 to IoT, wearable devices, drones, Virtual Reality (VR) and Augmented Reality (AR), and automotive systems.

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Posted in Automotive, C-PHY, Camera, CSI, D-PHY, Interface Subsystems, MIPI, Mobile SoC |

 

MIPI DevCon 2016: SoundWire VIP

MIPI DevCon 2016 was successfully held at Mountain View, California on 14-15th Sep, 2016. Synopsys MIPI protocol experts were there demonstrating our MIPI design and verification solutions for wide spectrum of markets ranging from IoT, to mobile, automotive, and consumer. During the conference Synopsys had several presentations.  One of the papers presented by Synopsys was based on a customer case study that provide an overview and successful adoption of the MIPI SoundWire VIP and Test Suites to achieve comprehensive verification and coverage closure on their latest MIPI design.

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Posted in Audio, Automotive, C-PHY, Camera, CSI, D-PHY, events, I2S, I3C, Interface Subsystems, MIPI, Mobile SoC, MPHY, SlimBus, Soundwire, Test Suites, UFS, Unipro |

 

Energy Efficient Designs with MIPI

Getting the best out of available battery technologies continues to be a challenge for mobile design companies. When phones were used for voice only, the battery lasted a few days compared to less than a day in case of smartphones with high resolution screens, cameras, powerful processors, gigabytes of memories and running power hungry software. Consumers continuously demand more features and functions from their mobile electronics and with more functions converged into a single device, it’s becoming extremely challenging for SoC designs to keep up with the exploding bandwidth, advanced integration functionality and low power constraints.

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Posted in Camera, CSI, D-PHY, DSI, Mobile SoC, MPHY, Uncategorized, Unipro |

 

MIPI D-PHY Revolutionizing Today’s Smartphone Market

We are capturing our memories in high-definition with the latest multi-megapixel cameras and playing back with the high resolution displays. This has led to a tremendous increase in data transfer and bandwidth requirements between peripherals and application processor in a mobile SoC. It’s challenging to support advanced multimedia features in the mobile phones by integrating megapixel cameras and superior resolution displays at a reduced cost and power consumption.

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Posted in Camera, CSI, D-PHY, Display, DSI, MIPI, Uncategorized |

 

Celebrating the Holiday Season with VIPs

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Posted in AMBA, Automotive, C-PHY, CAN, CSI, D-PHY, Data Center, DDR, DesignWare, DFI, Display, DSI, eMMC, Ethernet, Ethernet AVB, Flash, HBM, HDCP, HDMI, HMC, I3C, LPDDR, Memory, Methodology, MIPI, MPHY, NVMe, ONFi, PCIe, SATA, Storage, SystemVerilog, Test Suites, UFS, Unipro, USB |

 

Accelerate your MIPI CSI-2 Verification with a Divide and Conquer Approach

MIPI Alliance’s CSI-2 (Camera Serial Interface) has achieved widespread adoption in the smartphone industry for its ease-of-use and ability to support a broad range of imaging solutions. MIPI CSI-2 v1.3, which was announced in February 2015, also offers users the opportunity to operate CSI-2 on either of two physical layer specifications: MIPI D-PHY, which CSI-2 has used traditionally, as well as MIPI C-PHY, a new PHY that MIPI first released in September 2014. Products may implement CSI-2 solutions using either or both PHYs in the same design. MIPI CSI-2 v1.3 with C-PHY provides performance gains and increased bandwidth delivery for realizing higher resolution, better color depth, and higher frame rates on image sensors while providing pin compatibility with MIPI D-PHY.

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Posted in C-PHY, Camera, CSI, D-PHY, MIPI |