The demand for higher resolution displays is exploding across the market segments from electronics like television, monitors, laptops, and smartphones to the emerging technologies like video and vision, automotive, and AR/VR. The bandwidth requirement for displays increases multi-fold with higher resolution which has been the main driver for development of the latest DisplayPort 2.0 specification by VESA.
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Posted in Automotive, Display, DisplayPort, DSC, DSI, HDCP, HDMI, MHL, Mobile SoC |
Modern computer applications rely heavily on graphics processing and rendering which involve a lot of simultaneous mathematical calculations. A typical CPU is not suitable for jobs that require simultaneous processing, which is why the concept of a dedicated Graphics Processing Unit (GPU) was introduced. The GPU has found its scope not only in graphics processing but also several emerging applications like AI, machine learning, VR, autonomous driving, and network routing.
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Posted in Automotive, DDR, IoT, Memory |
The semiconductor industry is buzzing with new technologies – Artificial Intelligence (AI), Machine Learning (ML), IoT, Automotive, etc. – bringing a revolution by easing out our day-to-day lives and improving considerably performance, bandwidth and reliable data processing and transfer. Reliability and data integrity are even more important for safety critical verticals where even the slightest error can be catastrophic. Stepping up to meet industry trends, JEDEC recently announced its fifth revision of LPDDR standard JESD209-5 which is all equipped to match the latest bandwidth, power, performance, and reliability trends. Immediately following this, Synopsys announced the Industry’s First LPDDR5 IP & VIP Solution Extending Leadership in DDR5/LPDDR5. Strengthening our leadership in memory VIP, recently we also announced the Industry’s First DDR5 NVDIMM-P Verification IP, showing our continued collaboration with leading memory vendors.
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Posted in AI, Automotive, IoT, LPDDR, Memory, Uncategorized |
We recently published the VIP Newsletter for Apr 2019, containing trending topics, leading solutions, in depth technical articles, videos, webinars, and updates on next generation protocols. In case you missed the latest buzz on Verification IP, you can read it here.
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Posted in Data Center, DDR, Debug, LPDDR, Memory, Mobile SoC, PCIe, Processor Subsystems, Test Suites, Type C, USB |
The most awaited news of the year is officially here! USB Promoter Group has officially announced USB4 specification, which is an extensive upgrade over USB 3.2 specification. The new specification guarantees double the speed of USB 3.2 Gen 2×2, and has built in Thunderbolt™ 3 compatibility. The official specification release is expected by mid-2019.
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Posted in Automotive, Mobile SoC, Type C, USB |
The key features driving future memories are memory density, speed, lower operating voltage, and faster access. DDR5 supports memory density from 8Gb to 64Gb combined with a wide range of data rate from 3200 MT/s to 6400 MT/s. The operating voltage of DDR5 is further reduced from 1.2V of DDR4 to 1.1V.
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Posted in DDR, DFI, Memory |
High resolution 8k UHD displays for emerging technologies like connected cars, IoT, and AR/VR (Augmented/Virtual Reality) require high bandwidth to support the high-resolution transmission. MIPI DSI is the widely used display interface, but the bandwidth provided by PHY layers isn’t sufficient enough to support the high-resolution displays; therefore, a compression technique like DSC (Display Stream Compression) is required. One of our recent blog discussed about DSC 1.2 in HDMI 2.1 – High Resolution Displays for Mobile, TV, PC and Automotive Enabled by DSC 1.2 in HDMI 2.1. In this blog, we will see how DSC 1.2 enables MIPI DSI to support the high-resolution displays for emerging applications.
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Posted in Automotive, Display, DSC, DSI, Uncategorized |
The latest buzzword in the world of TVs and smartphones is High Dynamic Range (HDR). Many of us might already know that an HDR TV improves the viewing experience by offering better picture quality, just like people who use the latest smartphones know that turning on the HDR mode in the camera helps in capturing more lively pictures. In November 2017, the HDMI forum officially released HDMI 2.1 adding more to our joy, by offering the new and improved HDR. The announcement goes on to say “Dynamic HDR support ensures every moment of a video is displayed at its ideal values for depth, detail, brightness, contrast and wider color gamuts—on a scene-by-scene or even a frame-by-frame basis”. Before we explore HDR and Dynamic HDR in detail, let’s first understand how Standard Dynamic Range (SDR) works.
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Posted in Automotive, Camera, Display, DSC, HDMI, Mobile SoC |
Synopsys recently announced the fastest, and most power efficient DDR5 and LPDDR5 IP solutions. Industry’s first LPDDR5 controller, PHY, and verification IP solution supports data rates up to 6400 Mbps with up to 40% less area than previous generations. The LPDDR5 IP provides significant area and power savings for mobile and automotive SoCs with its dual-channel memory interface option that shares common circuitry between independent channels. The DesignWare DDR5 IP, operating at up to 4800 Mbps data rates, can interface with multiple DIMMs per channel up to 80 bits wide, delivering the fastest DDR memory interface solution for artificial intelligence (AI) and data center system-on-chips (SoCs). The DDR5 and LPDDR5 controller and PHY seamlessly interoperate via the latest DFI 5.0 interface.
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Posted in Automotive, Data Center, DDR, Debug, DesignWare, DFI, HBM, LPDDR, Memory, Mobile SoC |
We recently published the VIP Newsletter for Q4 2018, containing trending topics, leading solutions, in depth technical articles, videos, webinars, and updates on next generation protocols. The newsletter covers content on PCIe 5.0, Arm® AMBA® 5 ACE5 and AXI5, CCIX and next generation MIPI and display protocols and applications ranging from AI, Cloud, Display, Storage and Networking. In case you missed the latest buzz on Verification IP, you can read it here.
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Posted in ACE, AMBA, Audio, Automotive, AXI, Camera, CCIX, CHI, Data Center, Debug, DesignWare, Display, events, HDCP, HDMI, Interconnects, Interface Subsystems, MIPI, Mobile SoC, MPHY, PCIe, Processor Subsystems, Soundwire, Storage, Test Suites, Uncategorized |
