CXL 3.0 Introduction
Compute Express Link™ (CXL™) 3.0 is an open standard that defines high-speed cache-coherent interconnect and memory expander interconnect for CPU-to-device and CPU-to-memory connections. It is built on PCI Express® (PCIe®) 6.0 r1.0 specifications and leverages PCIe for physical and electrical interface.
Artificial Intelligence (AI) and Machine Learning (ML) applications and widespread smart devices (e.g., autonomous vehicles) are driving factors behind exponentially rising requirements to build high-performing data center units that involve CPUs connected with accelerator processors, memory attached devices, and SmartNICs. These systems demand low latency requirements for CPU-attached devices to perform compute-intensive operations on massive data while maintaining coherency. To meet the increasing performance and scale requirements of these systems, the CXL Consortium has evolved its standard through the introduction of CXL 3.0.
CXL 3.0 Specification Highlights
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Posted in AI, CXL, Data Center, DesignWare, Protocol Continuum, Verification Service
In this era of technology revolution, there is a continuous progression in domains like AI applications, high end servers, and graphics. These applications require fast processing and high densities for storing the data, where High Bandwidth Memory (HBM) provides the most viable memory technology solution. Our previous memory blog HBM2 memory for graphics, networking and HPC explored this protocol with data transfer rate of 2GT/s with stacked architecture of 8-Hi stacks (8 die).The HBM2-extension (HBM2E) architecture provided further improvement on top of HBM2 with 3.2 GT/s transfer rate and 12-Hi stack architecture with individual die density upto 8Gb and overall density of 24GB.
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Posted in Data Center, Debug, DesignWare, HBM, Uncategorized
Welcome to the wonderful and cryptic world of secured traffic with CXL being the latest specification to adopt it. As attacks on high-performance data centers become more sophisticated, the security standards must continuously adapt to better protect sensitive data and communications and ultimately protect our connected world. To this end, the CXL standards organization added the security requirement of Integrity and Data Encryption (IDE) to the CXL 2.0 specification.
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Posted in 5G, CXL, Data Center, DesignWare
As Data Center and Artificial Intelligence applications take center stage , last few years have seen the advent of various high bandwidth interconnect technologies. Compute Express Link (CXL), is an aspiring new interconnect technology for high bandwidth devices such as accelerators with memory, high density compute cards, and GPU comprised accelerators. The specification is defined by CXL Consortium https://www.computeexpresslink.org/. Synopsys has developed a comprehensive CXL verification subsystem, being already used by Early Adopters planning to release their first CXL applications. CXL verification subsystem leverages industry popular Synopsys PCI Express Verification IP. Synopsys recently introduced Industry’s first CXL IP solution. For more details refer Synopsys Delivers Industry’s First Compute Express Link (CXL) IP Solution for Breakthrough Performance in Data-Intensive SoCs.
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Posted in CXL, DesignWare, Interconnects, Mobile SoC, PCIe
Synopsys recently announced the fastest, and most power efficient DDR5 and LPDDR5 IP solutions. Industry’s first LPDDR5 controller, PHY, and verification IP solution supports data rates up to 6400 Mbps with up to 40% less area than previous generations. The LPDDR5 IP provides significant area and power savings for mobile and automotive SoCs with its dual-channel memory interface option that shares common circuitry between independent channels. The DesignWare DDR5 IP, operating at up to 4800 Mbps data rates, can interface with multiple DIMMs per channel up to 80 bits wide, delivering the fastest DDR memory interface solution for artificial intelligence (AI) and data center system-on-chips (SoCs). The DDR5 and LPDDR5 controller and PHY seamlessly interoperate via the latest DFI 5.0 interface.
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Posted in Automotive, Data Center, DDR, Debug, DesignWare, DFI, HBM, LPDDR, Memory, Mobile SoC
We recently published the VIP Newsletter for Q4 2018, containing trending topics, leading solutions, in depth technical articles, videos, webinars, and updates on next generation protocols. The newsletter covers content on PCIe 5.0, Arm® AMBA® 5 ACE5 and AXI5, CCIX and next generation MIPI and display protocols and applications ranging from AI, Cloud, Display, Storage and Networking. In case you missed the latest buzz on Verification IP, you can read it here.
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Posted in ACE, AMBA, Audio, Automotive, AXI, Camera, CCIX, CHI, Data Center, Debug, DesignWare, Display, events, HDCP, HDMI, Interconnects, Interface Subsystems, MIPI, Mobile SoC, MPHY, PCIe, Processor Subsystems, Soundwire, Storage, Test Suites, Uncategorized
This year’s PCI-SIG Developers Conference took place at the Santa Clara Convention Center on June 5-6. Synopsys provided several demos covering the PCIe 5.0 Integrated IP Core, PHY, and Verification IP & source code Test Suites. There was a constant pool of inquisitive attendees interacting with our PCIe design and verification experts regarding the demos.
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Posted in Data Center, Debug, DesignWare, events, NVMe, PCIe, Storage
In June 2017, PCI-SIG announced the new PCI Express 5.0 specification, at the PCI-SIG DevCon. The new version of the specification doubled bit rate to 32GT/s per lane providing about 128GB/s bandwidth for a x16 Link (16 lanes). The chart below provides a comparison of bit-rate and bandwidth for the different PCIe Generations.
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Posted in Automotive, Data Center, DesignWare, PCIe
The Design Automation Conference (DAC) 2016 was a great success and here we provide you the highlights of Synopsys’ activities at the event.
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Posted in AMBA, Audio, Automotive, Camera, CAN, Data Center, DDR, Debug, DesignWare, Display, eMMC, Ethernet, Ethernet AVB, Flash, FlexRay, HBM, HMC, Interconnects, Interface Subsystems, LIN, LPDDR, Memory, Methodology, MIPI, Mobile SoC, ONFi, PCIe, Processor Subsystems, Storage, SystemVerilog, Test Suites, UFS, Uncategorized, USB, UVM
The Design Automation Conference (DAC) 2016, in Austin, Texas kicks off next week starting June 5th to June 9th. As the leading and longest-running annual design and verification event, DAC is the premier place to network with fellow design and verification engineers.
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Posted in Audio, Automotive, Camera, Data Center, Debug, DesignWare, Display, Ethernet, Interface Subsystems, Methodology, Mobile SoC, PCIe, Processor Subsystems, Storage, Success Stories, SystemVerilog, Test Suites, Uncategorized, UVM
