HBM2E (High Bandwidth Memory) is a high-performance 3D-stacked DRAM used in high-performance computing and graphic accelerators. It uses less power but posts higher bandwidth than graphics cards relying on DDR4 or GDDR5 memory. Validating the performance and utilization of memory is a big challenge for users due to complex structure of SoC and the subsystem attached to it such as memory subsystem, interconnect bus, and processor.
Looking for ways to reduce debug cycles to quickly root cause the issues in your Memory Controller/PHY and Subsystem Verification Project?
We recently published the VIP Newsletter for Apr 2019, containing trending topics, leading solutions, in depth technical articles, videos, webinars, and updates on next generation protocols. In case you missed the latest buzz on Verification IP, you can read it here.
Synopsys recently announced the fastest, and most power efficient DDR5 and LPDDR5 IP solutions. Industry’s first LPDDR5 controller, PHY, and verification IP solution supports data rates up to 6400 Mbps with up to 40% less area than previous generations. The LPDDR5 IP provides significant area and power savings for mobile and automotive SoCs with its dual-channel memory interface option that shares common circuitry between independent channels. The DesignWare DDR5 IP, operating at up to 4800 Mbps data rates, can interface with multiple DIMMs per channel up to 80 bits wide, delivering the fastest DDR memory interface solution for artificial intelligence (AI) and data center system-on-chips (SoCs). The DDR5 and LPDDR5 controller and PHY seamlessly interoperate via the latest DFI 5.0 interface.
We recently published the VIP Newsletter for Q4 2018, containing trending topics, leading solutions, in depth technical articles, videos, webinars, and updates on next generation protocols. The newsletter covers content on PCIe 5.0, Arm® AMBA® 5 ACE5 and AXI5, CCIX and next generation MIPI and display protocols and applications ranging from AI, Cloud, Display, Storage and Networking. In case you missed the latest buzz on Verification IP, you can read it here.
Posted in ACE, AMBA, Audio, Automotive, AXI, Camera, CCIX, CHI, Data Center, Debug, DesignWare, Display, events, HDCP, HDMI, Interconnects, Interface Subsystems, MIPI, Mobile SoC, MPHY, PCIe, Processor Subsystems, Soundwire, Storage, Test Suites, Uncategorized |
We recently published the VIP Newsletter for Q3 2018, containing trending topics, leading solutions, in depth technical articles, videos, webinars, and updates on next generation protocols. The newsletter covers content on DFI 5.0 for DDR5/LPDDR5, NVMe 1.3, USB 3.2, PCIe 5.0, next generation gaming displays, MIPI CSI-2 v2.1 for Automotive and IoT, and Verdi performance analyzer and protocol debug. In case you missed the latest buzz on Verification IP, you can read it here.
This year’s PCI-SIG Developers Conference took place at the Santa Clara Convention Center on June 5-6. Synopsys provided several demos covering the PCIe 5.0 Integrated IP Core, PHY, and Verification IP & source code Test Suites. There was a constant pool of inquisitive attendees interacting with our PCIe design and verification experts regarding the demos.
Debugging the complex serial protocols is the biggest challenge verification engineers face. It’s one of the most time and effort consuming activity affecting the schedule of every project. Traditional debug methodologies use a combination of loosely connected waveforms, log files, messages, and documentation, which are insufficient for productive debugging. Debugging SoC and block level issues using log files is tedious and time consuming. Design problems that appear in the later phases of the development cycle can be extremely difficult to track down and debug, thus putting project schedules at risk.
In today’s world of smartphones and tablets, high speed data at low power consumption is becoming increasingly important. MIPI M-PHY supports multiple applications with high data bandwidth and low power consumption which makes it a popular specification for mobile devices. Applications like JEDEC UFS 3.0 and MIPI UniPro 1.8 now support MIPI M-PHY 4.1 which provides high speed data at a rate of nearly 11Gbps (HS_G4). To learn more about latest UFS and UniPro specifications read our previous blog “High Speed Memory in Smart Phones: MIPI UniPro v1.8 for JEDEC UFS v3.0”. Data at such a high speed can lead to inter-symbol-interference (ISI). M-PHY provides a safety measure to prevent the loss of data at HS_G4. In this blog, we are going to talk about the ‘ADAPT’ feature and its advantages which were introduced in M-PHY 4.0.
We recently published the VIP Newsletter for Jan 2018, containing trending topics, leading solutions, in depth technical articles, videos, webinars, and updates on next generation protocols. In case you missed the latest buzz on Verification IP, you can read it here.
Posted in ACE, AMBA, Automotive, AXI, C-PHY, Camera, CHI, CSI, D-PHY, Data Center, DDR, Debug, Flash, Interconnects, LPDDR, Memory, Methodology, MIPI, Mobile SoC, NVMe, PCIe, Processor Subsystems, SPI, Storage, SystemVerilog, Test Suites, Type C, Uncategorized, UVM |