We recently published the VIP Newsletter for Apr 2019, containing trending topics, leading solutions, in depth technical articles, videos, webinars, and updates on next generation protocols. In case you missed the latest buzz on Verification IP, you can read it here.
Synopsys recently announced the fastest, and most power efficient DDR5 and LPDDR5 IP solutions. Industry’s first LPDDR5 controller, PHY, and verification IP solution supports data rates up to 6400 Mbps with up to 40% less area than previous generations. The LPDDR5 IP provides significant area and power savings for mobile and automotive SoCs with its dual-channel memory interface option that shares common circuitry between independent channels. The DesignWare DDR5 IP, operating at up to 4800 Mbps data rates, can interface with multiple DIMMs per channel up to 80 bits wide, delivering the fastest DDR memory interface solution for artificial intelligence (AI) and data center system-on-chips (SoCs). The DDR5 and LPDDR5 controller and PHY seamlessly interoperate via the latest DFI 5.0 interface.
We recently published the VIP Newsletter for Q4 2018, containing trending topics, leading solutions, in depth technical articles, videos, webinars, and updates on next generation protocols. The newsletter covers content on PCIe 5.0, Arm® AMBA® 5 ACE5 and AXI5, CCIX and next generation MIPI and display protocols and applications ranging from AI, Cloud, Display, Storage and Networking. In case you missed the latest buzz on Verification IP, you can read it here.
Posted in ACE, AMBA, Audio, Automotive, AXI, Camera, CCIX, CHI, Data Center, Debug, DesignWare, Display, events, HDCP, HDMI, Interconnects, Interface Subsystems, MIPI, Mobile SoC, MPHY, PCIe, Processor Subsystems, Soundwire, Storage, Test Suites, Uncategorized |
Artificial intelligence and machine learning are rapidly penetrating a wide spectrum of devices, driving the re-architecture of SoC designs, requiring more memory space and higher bandwidth to transfer and process data. This change requires higher speed interfaces and wider buses, paving the path for enhancements in latest PCIe, USB, DP, and SATA protocol specifications, as well as upgrades in PIPE (PHY Interface for the PCI Express) specification as the preferred PHY interface.
Next generation SoC designs require faster coherent interconnects for high performance applications such as machine learning, network processing, storage off-load, in-memory data base and 4G/5G wireless technology. CCIX (Cache Coherent Interconnect for Accelerators), a new protocol standard, provides benefits of cache coherency and peer processing which enables the faster interconnect. CCIX is designed smartly to use the well-established PCIe infrastructure to carry coherency packets across the link with little modification. CCIX specification is compatible with PCIe base specification 4.0. PCIe implementation is extended to implement a CCIX transaction layer, responsible for carrying the coherency messages.
We recently published the VIP Newsletter for Q3 2018, containing trending topics, leading solutions, in depth technical articles, videos, webinars, and updates on next generation protocols. The newsletter covers content on DFI 5.0 for DDR5/LPDDR5, NVMe 1.3, USB 3.2, PCIe 5.0, next generation gaming displays, MIPI CSI-2 v2.1 for Automotive and IoT, and Verdi performance analyzer and protocol debug. In case you missed the latest buzz on Verification IP, you can read it here.
This year’s PCI-SIG Developers Conference took place at the Santa Clara Convention Center on June 5-6. Synopsys provided several demos covering the PCIe 5.0 Integrated IP Core, PHY, and Verification IP & source code Test Suites. There was a constant pool of inquisitive attendees interacting with our PCIe design and verification experts regarding the demos.
The growth of datacenter, storage, automotive and other emerging market applications is driving the development of next-generation memory technologies – DDR5, LPDDR5. Like their predecessors, the latest memory technologies also use DFI, a standard interface between memory controller and PHY, to reduce the integration cost and increase performance and data throughput efficiency. DFI also has evolved along with the memory technologies, and next generation DFI 5.0 is here to ensure higher performance in the systems using DDR5/LPDDR5. In this blog, we will discuss the new features of DFI 5.0 specification.
With the rise of cloud computing and large scale data centers, both developers and consumers are demanding for more efficient ways to rapidly access their data. Seeing the advantage of its high performance, the storage industry is quickly adopting the Non-Volatile Memory Express (NVMe) standard. The NVMe™ standard continues to push the storage envelope with version 1.3 and beyond in all types of computing environments from mobile to data center. One of the key features of the NVMe™ standard is its ability to handle virtualization.
New applications like Cloud Computing, Artificial Intelligence, Autonomous cars, Augmented reality, Embedded vision are driving stricter requirements around memory performance and power efficiency. Memory is central to these systems, that require high bandwidth and speed along with lower power and lower cost. With these emerging market needs, the memory industry started to move from planar (2D) DRAMs to wide I/O or a 3D technology TSVs (Through Silicon Vertical interconnect access) such as HBM (high bandwidth memory). For more insight on HBM, read our blog “Next Generation Memory Technology for Graphics, Networking and HPC.” Low Power DRAM technology, evolved to the fifth-generation(LPDDR5) to deliver significant reduction in power and extremely high bandwidth as compared to LPDDR4. In this blog, we discuss LPDDR5 new features based on our understanding from collaboration with memory vendors and early adopters of Synopsys VIP over last 2 years.