The Design Automation Conference (DAC) 2016 was a great success and here we provide you the highlights of Synopsys’ activities at the event.
Posted in AMBA, Audio, Automotive, Camera, CAN, Data Center, DDR, Debug, DesignWare, Display, eMMC, Ethernet, Ethernet AVB, Flash, FlexRay, HBM, HMC, Interconnects, Interface Subsystems, LIN, LPDDR, Memory, Methodology, MIPI, Mobile SoC, ONFi, PCIe, Processor Subsystems, Storage, SystemVerilog, Test Suites, UFS, Uncategorized, USB, UVM
One of the most important inventions of mankind is the “wheel”. What started as a small means of transportation has turned into a revolution that changed the dynamics of how the world runs today. Imagine a world without wheel – scary and impossible to accept. With the wheel around, the first step to automotive industry was laid with a simple carriage, and exponentially grew into one of the biggest economic sectors running over billions of automobiles.
The Automotive industry is going through a revolution with innovations like driver less car, connected vehicles, electric and hybrid engines. Google and Tesla driverless cars have covered millions of miles in testing and Chinese driverless car is also ready for testing. The innovation in automotive industry is driven by rapid deployment of integrated electronics and car chip market has grown at scorching rate to tens of billions. Synopsys is taking the innovation in car systems design and verification to next level and recently announced the expansion of its VC Verification IP (VIP) portfolio with CAN 2.0/FD/TT (ISO 16845 compliant), LIN, FlexRay™, and Ethernet Audio Video Bridging (AVB) protocols for the verification of automotive applications.
We are living in a connected world and there are over a billion Ethernet devices around the world today. It is very interesting how Ethernet has evolved from a simple standard supporting 10 Mbps to multitude of speed modes and ubiquitous applications. From being a standard that traditionally evolved with 10x speed jumps (10M, 100M, 1G, 10G, 100G), it is now growing rapidly at non-10x speed modes (2.5G, 25G, 40G, 50G, 200G, and latest 400G) and covering diverse application areas to satisfy consumer needs.
Posted in AMBA, Automotive, C-PHY, CAN, CSI, D-PHY, Data Center, DDR, DesignWare, DFI, Display, DSI, eMMC, Ethernet, Ethernet AVB, Flash, HBM, HDCP, HDMI, HMC, I3C, LPDDR, Memory, Methodology, MIPI, MPHY, NVMe, ONFi, PCIe, SATA, Storage, SystemVerilog, Test Suites, UFS, Unipro, USB