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RTL Signoff vs. Functional Signoff: What’s the Difference?

By Bradley Geden, Manoz Palaparthi

5 min read / Jul 01, 2025

Tags: Verification Central , Multi-Die System , RTL Synthesis , Static & Formal Verification , AI & Machine Learning , Debug , Physical Verification , Test , Simulation , Energy-Efficient SoCs , Signoff , Chip Design Insights , Design , Verification , Formal Verification

The Integrated Design Challenge: Developing Chip, Software, and System in Unison

By Synopsys Editorial Staff

6 min read / Jun 25, 2025

Tags: AI & Machine Learning , Chip Design Insights , Design , Design Technology Co-Optimization , Silicon IP

Why Hardware Security Is Just as Critical as Software Security in Modern Systems

By Vincent van der Leest, Mike Borza

4 min read / Jun 18, 2025

Tags: Chip Design Insights , Security IP , DevSecOps , Silicon IP

PCIe 6.x and 112 Gbps Ethernet: Synopsys and TeraSignal Achieve Optical Interconnect Breakthroughs

By Magaly Sandoval-Pichardo

2 min read / Jun 12, 2025

Tags: Chip Design Insights , Design , Interface IP , HPC, Data Center , Silicon IP , Optical

The Integrated Design Challenge: Developing Chip, Software, and System in Unison

By Synopsys Editorial Staff

Tags: AI & Machine Learning, Chip Design Insights, Design, Design Technology Co-Optimization, Silicon IP

3 min read/May 28, 2025

High Bandwidth Memory (HBM) at the AI Crossroads: Customization or Standardization?

By Synopsys Editorial Staff

Tags: Verification Central, Multi-Die System, AI & Machine Learning, Memory, Chip Design Insights, Design, Interface IP, Verification IP, HPC, Data Center, Silicon IP, Verification, 3DIC Design

3 min read/May 19, 2025

Advancing Chip Design with AI: Synopsys AI Collaboration Featured at Microsoft Build

By Synopsys Editorial Staff

Tags: AI & Machine Learning, Chip Design Insights, Design

EDA in the Cloud

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5 min read/Jun 10, 2025

Software-Defined Vehicles: Agile Development with Cloud-Based Virtual Prototypes

By Gunnar Braun, Stewart Williams

5 min read/Jun 10, 2025

Tags: Cloud, Insights, Chip Design Insights, Automotive, Cloud Insights, Verification, Virtual Prototyping

5 min read/Jun 04, 2025

Synopsys Expands Collaboration with Arm to Accelerate the Automotive Industry’s Transformation to Software-Defined Vehicles

By Tom De Schutter

Tags: Cloud, Chip Design Insights, Design, Verification IP, Automotive, Verification, Virtual Prototyping

3 min read/May 22, 2025

Faster, More Collaborative SoC and Chiplet Architecture Exploration: Introducing Synopsys Platform Architect Development Kit (PADK)

By Kamal Desai

Tags: Verification Central, Cloud, Multi-Die System, Prototyping, Chip Design Insights, Design, Verification, Virtual Prototyping

3 min read/Mar 09, 2025

Transforming Edge Software Development with Arm-based Virtual Prototyping

By Malte Doerper

Tags: Cloud, Product Spotlight, Prototyping, Chip Design Insights, Design, Verification, Virtual Prototyping

Multi-Die Systems

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5 min read/Jul 01, 2025

RTL Signoff vs. Functional Signoff: What’s the Difference?

By Bradley Geden, Manoz Palaparthi

5 min read/Jul 01, 2025

Tags: Verification Central, Multi-Die System, RTL Synthesis, Static & Formal Verification, AI & Machine Learning, Debug, Physical Verification, Test, Simulation, Energy-Efficient SoCs, Signoff, Chip Design Insights, Design, Verification, Formal Verification

3 min read/May 28, 2025

High Bandwidth Memory (HBM) at the AI Crossroads: Customization or Standardization?

By Synopsys Editorial Staff

Tags: Verification Central, Multi-Die System, AI & Machine Learning, Memory, Chip Design Insights, Design, Interface IP, Verification IP, HPC, Data Center, Silicon IP, Verification, 3DIC Design

3 min read/May 22, 2025

Faster, More Collaborative SoC and Chiplet Architecture Exploration: Introducing Synopsys Platform Architect Development Kit (PADK)

By Kamal Desai

Tags: Verification Central, Cloud, Multi-Die System, Prototyping, Chip Design Insights, Design, Verification, Virtual Prototyping

4 min read/May 15, 2025

Multi-Die Design Challenges: Industry Leaders Provide Insights and Guidance

By Frank Malloy

Tags: Multi-Die System, Chip Design Insights, Design, 3DIC Design

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Vikram Bhatia

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Jyotika Athavale

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Shekhar Kapoor

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Spotlight

RTL Signoff vs. Functional Signoff: What’s the Difference?

The Integrated Design Challenge: Developing Chip, Software, and System in Unison

Why Hardware Security Is Just as Critical as Software Security in Modern Systems

PCIe 6.x and 112 Gbps Ethernet: Synopsys and TeraSignal Achieve Optical Interconnect Breakthroughs

Trending Topics

RTL Signoff vs. Functional Signoff: What’s the Difference?

The Integrated Design Challenge: Developing Chip, Software, and System in Unison

The Integrated Design Challenge: Developing Chip, Software, and System in Unison

High Bandwidth Memory (HBM) at the AI Crossroads: Customization or Standardization?

Advancing Chip Design with AI: Synopsys AI Collaboration Featured at Microsoft Build

Software-Defined Vehicles: Agile Development with Cloud-Based Virtual Prototypes

Synopsys Expands Collaboration with Arm to Accelerate the Automotive Industry’s Transformation to Software-Defined Vehicles

Synopsys Expands Collaboration with Arm to Accelerate the Automotive Industry’s Transformation to Software-Defined Vehicles

Faster, More Collaborative SoC and Chiplet Architecture Exploration: Introducing Synopsys Platform Architect Development Kit (PADK)

Transforming Edge Software Development with Arm-based Virtual Prototyping

RTL Signoff vs. Functional Signoff: What’s the Difference?

High Bandwidth Memory (HBM) at the AI Crossroads: Customization or Standardization?

High Bandwidth Memory (HBM) at the AI Crossroads: Customization or Standardization?

Faster, More Collaborative SoC and Chiplet Architecture Exploration: Introducing Synopsys Platform Architect Development Kit (PADK)

Multi-Die Design Challenges: Industry Leaders Provide Insights and Guidance

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