VIP Central

Come sprint with the champs at JEDEC DDR5, LPDDR5 & NVDIMM-P Workshops & Trainings

We are excited to attend the upcoming JEDEC workshops and tutorial in Santa Clara, October 7th – 10th. The workshops will provide an introduction and in-depth technical review of the DDR5, LPDDR5 and NVDIMM-P standards as well as present the latest reliability and optimization features.

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HBM Performance Verification Made Easy

HBM2E (High Bandwidth Memory) is a high-performance 3D-stacked DRAM used in high-performance computing and graphic accelerators. It uses less power but posts higher bandwidth than graphics cards relying on DDR4 or GDDR5 memory. Validating the performance and utilization of memory is a big challenge for users due to complex structure of SoC and the subsystem attached to it such as memory subsystem, interconnect bus, and processor.

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Detect & Avoid Memory Bottlenecks with Memory VIP

The growing disparity between processor and memory speeds has caused memory bandwidth to become the performance bottleneck for many applications. For example, have you spent sleepless nights looking for ways to identify the performance bottlenecks and root cause them in your Memory Controller/PHY and Subsystem verification project?

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How to Reduce Memory Model Debug Time

Looking for ways to reduce debug cycles to quickly root cause the issues in your Memory Controller/PHY and Subsystem Verification Project?

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MIPI CSI-2 v3.0 is here! – The industry’s First Comprehensive Solution for 5G, Imaging, Surveillance and Automotive

Smartphones have become a one-man army by incorporating fancy features like biometric authentication, telemedicine, heartrate monitoring. With increasing market demands and requirements for higher image resolutions, MIPI CSI-2 (Camera Serial Interface) has evolved tenfold from where it first started. MIPI CSI-2 v2.0 is designed for use in smartphones, Internet of Things (IoT) devices, wearables, medical devices, augmented and virtual reality. MIPI Board recently adopted MIPI CSI-2 Specification v3.0 and approved associated CTS documents, refer https://members.mipi.org/wg/All-members/document/download/79549.

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Coverage Models – Filling in the Holes for Memory VIP

Looking for a way to reduce effort defining and tracking functional verification goals in your Memory Controller/PHY and Subsystem Verification Project?

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De-mystifying CXL: An overview

As Data Center and Artificial Intelligence applications take center stage , last few years have seen the advent of various high bandwidth interconnect technologies. Compute Express Link (CXL), is an aspiring new interconnect technology for high bandwidth devices such as accelerators with memory, high density compute cards, and GPU comprised accelerators. The specification is defined by CXL Consortium https://www.computeexpresslink.org/. Synopsys has developed a comprehensive ­­CXL verification subsystem, being already used by Early Adopters planning to release their first CXL applications. CXL verification subsystem leverages industry popular Synopsys PCI Express Verification IP. Synopsys recently introduced Industry’s first CXL IP solution. For more details refer Synopsys Delivers Industry’s First Compute Express Link (CXL) IP Solution for Breakthrough Performance in Data-Intensive SoCs.

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NVDIMMs – A Perfect Blend of Memory and Storage

Servers are the core of today’s computational world, processing and storing data on multi-user platforms. Server performance depends on latency and capacity of its memory and storage. In general, DDR-DIMMs (Double Data Rate Dual In-line Memory Modules) are used as server memory, whereas SSDs/HDDs are used as storage in server. Whenever a service request is made to the server, it may require both data processing and storage. In order to execute this service, the processor accesses DDR-DIMMs and SSDs/HDDs. In addition, SSDs/HDDs can be accessed in case of power loss, storing data using backup power sources so data can be retrieved once power is available again.

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USB4 Is Here – USB-IF Ratifies USB4 specification

USB4 is the next generation of the Universal Serial Bus and a major update to the interface in speed and functionality. USB4 has incorporated Thunderbolt 3 capabilities, which extends support of USB interface to existing PCIE, and DisplayPort over the same USB Type-C connector. USB4 doubles the maximum overall throughput from 20Gbps to 40Gbps enabling optimized HD video and data transfer simultaneously. USB4 enables many applications using USB Type-C, which already supports power delivery, USB 3.2, USB 2.0 and other alternative protocols.

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Ethernet Time-Sensitive Network (TSN): A Boon for Automotive Audio-Video Bridging (AVB) Applications

Autonomous cars, vehicle communication and infotainment electronic systems are prevalent in today’s automobiles and everyday life. But, what does this mean for SoCs today?

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