From inception, NVMe was designed to support multiple hosts accessing shared media. Early implementation included PCIe in-the-box devices such as Endpoint(EP), Root complex(RC) and Root complex integrated endpoint(RCiEP); over time, Cloud and Storage infrastructure created a need for remote storage.
Synopsys offers a broad set of verification solutions for next generation Arm® AMBA® protocols, including AMBA5 CHI Issue D(CHI-D), and verification automation solutions including VC AutoTestbench for Testbench Generation and VC Autoperformance for Performance Verification of ARM based protocols, which designers have widely adopted and achieved numerous tape-out successes. We continue the rapid expansion of Synopsys’ verification solutions for AMBA protocols and strengthen our leadership with our latest offering of VIP for AMBA ACE5 and AXI5, which are already in use by early adopters of the new specifications. Synopsys VIP for the AMBA5 CHI Issue D (CHI-D) specification enabled early customers and partners to extend the standard architecture for their next-generation coherent designs with new enhancements for increased performance. Let’s dive down to understand more about the new features and latency optimization techniques available in AMBA5 CHI Issue D.
Billions of internet-connected devices and data-intensive real-time applications are expected to appear on the market in the near future and 100 Gigabit Ethernet (GE) speeds, common in data centers today, will just not be fast enough to handle the bandwidth. Therefore, we’re already anticipating the need for data center operators to migrate their networks from 100 GE to 400 GE, creating demand for faster memory and faster serial bus communications.
Arm TechCon was successfully held at San Jose Convention Center on 8-10th October, 2019. Synopsys protocol experts were there demonstrating our verification solutions for attendees from a wide spectrum of markets like IoT, mobile, automotive, and consumer.
We are excited to attend the upcoming JEDEC workshops and tutorial in Santa Clara, October 7th – 10th. The workshops will provide an introduction and in-depth technical review of the DDR5, LPDDR5 and NVDIMM-P standards as well as present the latest reliability and optimization features.
HBM2E (High Bandwidth Memory) is a high-performance 3D-stacked DRAM used in high-performance computing and graphic accelerators. It uses less power but posts higher bandwidth than graphics cards relying on DDR4 or GDDR5 memory. Validating the performance and utilization of memory is a big challenge for users due to complex structure of SoC and the subsystem attached to it such as memory subsystem, interconnect bus, and processor.
The growing disparity between processor and memory speeds has caused memory bandwidth to become the performance bottleneck for many applications. For example, have you spent sleepless nights looking for ways to identify the performance bottlenecks and root cause them in your Memory Controller/PHY and Subsystem verification project?
Looking for ways to reduce debug cycles to quickly root cause the issues in your Memory Controller/PHY and Subsystem Verification Project?
Smartphones have become a one-man army by incorporating fancy features like biometric authentication, telemedicine, heartrate monitoring. With increasing market demands and requirements for higher image resolutions, MIPI CSI-2 (Camera Serial Interface) has evolved tenfold from where it first started. MIPI CSI-2 v2.0 is designed for use in smartphones, Internet of Things (IoT) devices, wearables, medical devices, augmented and virtual reality. MIPI Board recently adopted MIPI CSI-2 Specification v3.0 and approved associated CTS documents, refer https://members.mipi.org/wg/All-members/document/download/79549.
Looking for a way to reduce effort defining and tracking functional verification goals in your Memory Controller/PHY and Subsystem Verification Project?
A global team of protocol experts that share their insights and technical expertise in the areas of Automotive, DRAM and Flash Memories, Storage, Display, MIPI, AMBA, Ethernet, PCIe, USB and many other bus and interface protocols. This comprehensive team participates in standards committees and will provide the latest information and updates as it relates to your future design considerations.