To USB or Not to USB


Learn How Inuitive Achieved First-Pass Silicon Success for NU3000 Multi-Core Signal Processor with DesignWare USB 3.0


We just published a new success story which covers how Inuitive used the DesignWare USB 3.0 IP (and other IP such as DDR, MIPI & Foundation) to help achieve first time silicon success for the NU3000 multi-core signal processor. Inuitive is a fabless semiconductor company. The NU3000 is a multi-core signal processor chip aimed to support 3D Image Processing and Computer Vision (CV) processing. NU3000 is the most advanced and optimized ASIC as of today in the market of 3D imaging and smart sensor HUB. The NU3000 aims to support new applications where 3D depth and computer vision is required. It can operate as a stand-alone device (Smart 3D sensor HUB) or be embedded into existing solutions as a co-processor for image processing and CV. Inuitive is first and the only one to offer a dedicated and complete 3D image processing and CV co-processor. Inuitive co-processor off-loads the main processor, thus reducing system response time, saving power and increasing performance. The NU3000 is optimized for mobile applications and markets, including: Virtual Reality Head Mount Displays, Augmented Reality glasses, smartphones, tablets and laptops.

Image of the Inuitive NU3000 from


The challenges that Inuitive faced

  • Develop and deploy a complex multi-core 3D sensing engine for mobile devices
  • Acquire proven IP to reduce risk on standard interfaces and accelerate time-to-market
  • Meet stringent power, performance and area objectives

Inuitive selected the following DesignWare IP to help solve these challenges

The results

  • Achieved first-pass silicon success under extreme time and market pressure
  • Reduced design risk with broad portfolio of silicon-proven DesignWare IP
  • Met requirements for low power, small area, and high performance while ensuring interoperability with multiple image sensors
  • Received responsive technical support from a local team

Read the complete success story here

Quote: Dor Zepeniuk, Vice President of R&D, Inuitive

The maturity and quality of the certified DesignWare USB 3.0 controller and USB femtoPHY is impressive, especially considering the complexity of the protocol and the IP solution’s small area and low power consumption.

This highlights the value the DesignWare IP brings to the table benefiting our customers. For our USB customers they specifically benefit from the following

Lowest Risk USB Solution Available

  • Controller and PHY interoperability validated across 1000’s of simulations and 100’s of hardware prototypes
  • Solution USB-IF certified by Synopsys 100’s of times, across over 120 process nodes and by 1000’s of customer products
  • Reliable USB operation in over 3000 designs, billions of products shipped
  • For 15+ years, 1st to achieve USB-IF solution certification from 180nm to 10nm
  • Supporting USB 1.1 to USB 3.1 Gen 2 including Type-C and DisplayPort Alt mode

Up to 50% smaller area lowers chip cost up to 3 cents compared to competitive solutions

Optimized solution yields up to 20% higher system performance with over 95% throughput efficiency

Up to 30% lower active state power and >97% hibernation power reduction extends battery life, reduces heat

Immediate productivity with USB IP prototyping kits accelerating software development and SoC bring up by 6 to 8 weeks

Save >3 months of SoC integration effort with preconfigured, easy to use & optimized deliverables

Fast worldwide USB IP support backed by 100s of USB experts


With all this you can see why the DesignWare USB IP is the IP of choice for implementing USB in todays designs.

Talking of Type-C, there is a great TechDesignForum article recently published titled “Implementing USB Type-C” : A look at three design challenges for USB Type-C: implementing two SuperSpeed datapaths on a reversible connector; partitioning the design to support multiple USB Type-C variants; and partitioning the management software. I highly recommend it for anyone considering USB Type-C in their next design.



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