Many customers approached us in the last year inquiring about I3C, its benefits and market adoption. The I3C benefits compared to other Sensor interfaces used today, such as I2C and SPI are clear. There are many sensor interfaces which cause unnecessary fragmentation, and are not optimized for system power efficiently for communication with sensors. These drawbacks limit applications and scalability for usage of sensors in mobile, IoT, embedded, automotive environments.
Microsoft shared some interesting details about their 28nm SoC design targeting augmented reality headset. Well, that is not just a processor, it’s custom vision processor which Microsoft calls HoloLens Processing Unit (HPU) as it is specifically targeting the augmented (possibly also virtual) reality needs. It is very interesting to see the computing power that was implemented on the chip to accommodate the imaging algorithms that used. The interfaces used on this chip are referenced as PCIe, DDR and MIPI. As the HPU uses several camera interfaces, depth and motion sensor for image identification and processing, recognizing gestures it’s clear that MIPI Camera and Display interfaces are probably used extensively. As per the die plot provided, the MIPI interfaces take a very small area of the processor compared to the computing blocks that are dominant utilizing 24 cores.
As electronics become smarter, require less human intervention, the machines around us are capable of doing more, making decisions based on environment and conditions. To facilitate that more sensors are used in electronics devices, it is common to see >12 sensors in latest smartphones used in the market, but this smarter device trend goes beyond mobile to markets such as consumer, industrial and automotive.