Posted by Hezi Saar on April 16, 2013
Discussing and sharing opinions is what drives our industry forward; however sharing ideas becomes more challenging in our time where competition is intense. This is true for any industry but even more relevant to the high-pace mobile market where wrong move can cost you a fortune. It is that important then to stay connected and aligned with market trends so you’re not caught off guard and mitigate design and market risks while enabling to take a leadership position.
I’ll be at the Linley Mobile conference which starts tomorrow (April 17 2013) and will be speaking on Thursday April 18th, during the Power-Optimized Design session which starts at 2:35pm, about meeting power, performance and reusability requirements for mobile systems. I will specifically address the growing needs in high performance and mobile-friendly interfaces for chip-to-chip communication such as USB3.0 SSIC and Mobile PCI Express.
These interfaces address the growing needs in higher data throughput transmitted between devices and allow the re-use of existing infrastructure while delivering mobile-friendly solution.
It’ll be good to see you, share ideas about your next design needs and discuss alternative paths.
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Views and Trends in mobile electronics connectivity related to MIPI IP
I started my career as an R&D engineer for embedded systems, then transitioned into applications engineering and product marketing roles in the semiconductor industry. With my systems knowledge, I have led many IC design wins that have enabled portable applications such as cellular phones, digital cameras and eBooks.
What intrigues me about the mobile electronics market is how rapid technological innovations, economic forces and changing consumer preferences drive market direction. Let’s explore these developments together.
– Hezi Saar