On The Move

Many customers approached us in the last year inquiring about I3C, its benefits and market adoption. The I3C benefits compared to other Sensor interfaces used today, such as I2C and SPI are clear. There are many sensor interfaces which cause unnecessary fragmentation, and are not optimized for system power efficiently for communication with sensors. These […]

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Microsoft shared some interesting details about their 28nm SoC design targeting augmented reality headset. Well, that is not just a processor, it’s custom vision processor which Microsoft calls HoloLens Processing Unit (HPU) as it is specifically targeting the augmented (possibly also virtual) reality needs. It is very interesting to see the computing power that was […]

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  Ramesh Hanchinal, R&D Engineer at Synopsys and Member of MIPI UniPro Working Group contributed the write up below, describing common question by designers using UniPro about power mode change implementation. Power Mode Change defined in specification The Local initiates Power mode change by transmitting the PACP_PWR_req packet. It waits for the reception of PACP_PWR_cnf […]

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As electronics become smarter, require less human intervention, the machines around us are capable of doing more, making decisions based on environment and conditions. To facilitate that more sensors are used in electronics devices, it is common to see >12 sensors in latest smartphones used in the market, but this smarter device trend goes beyond […]

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UFS is gaining momentum with more phones such as Samsung Galaxy S6 and LG G5, and potentially more phones are coming to the market in 2nd half of 2016 with UFS memory on board. The performance improvements from the mainstream, mature eMMC allows SoCs targeting high end phones a way to differentiate and provide a […]

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I just came back from the MIPI alliance face-to-face meeting last week that was engaging and interesting. At the beginning of the week, as part of the plenary session the MIPI alliance recognized several specifications with the key contributors. Here’s a picture of main contributors for D-PHY v2.0 spec including Intel Henrik and Synopsys Raj […]

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In the last post I asked what is MIPI Alliance’s most popular specification in terms of adoption as of today. The best resource I consider to answer this question is the latest MIPI Ecosystem Survey conducted by IPNest in 2015. The methodology behind this survey was to check with all 263 members of the MIPI […]

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I got several inquiries about adoption rate of physical layers across the mobile and adjacent industries after posting the video showing D-PHY v1.2 silicon on 16nm I realize that it’s debatable if it’s fair to compare one spec vs the other. However, I would like to note that de-facto standard has a lot of weight […]

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JEDEC UFS is an Accredited Standard, developed and adopted through an open consensus process, under the guidelines of JEDEC. The power of having a standard is that the industry has recognized a useful way to implement things both technically and economically, and through the procedure governed by the standard body (JEDEC for example) enable vendors […]

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In my last post I was discussing how to reduce display data transmission using Display Compression technology. Reducing transmitted traffic while supporting a higher link rate allows to reduce pin count, power consumption and area (cost) of implementation. In the Oct’15 MIPI Face-to-face meeting we (Synopsys) showed the Industry’s first DPHY v1.2 operating at 2.5Gbps/lane […]

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