Explore the impact of AI and ML on the chip design industry and learn how chiplet-enabled multi-die systems solve processing, memory, and bandwidth limitations.
Posted in Artificial Intelligence, EDA, Multi-Die Systems
Learn why 2023 will be big for multi-die systems, as chip designers use chiplet technology and the UCIe standard to meet growing PPA requirements in HPC & beyond.
Posted in Multi-Die Systems
Three key technologies will transform electronic design in 2023, including cloud-based EDA tools, multi-die systems, and silicon lifecycle management (SLM).
Posted in Cloud, EDA, Multi-Die Systems
We recap 2022 at Synopsys, including cloud-based chip design tools, machine learning and AI-powered EDA solutions, multi-die systems, and secure interface IP.
Posted in Artificial Intelligence, Cloud, EDA, HPC, Inside Synopsys, IP, Multi-Die Systems, Photonics
Explore the multi-die 3DIC technology that’s helping chip designers meet growing compute demands, including chiplets, 3D stacking, nanosystems, and more.
Posted in Multi-Die Systems
We explain chiplets and share how Universal Chiplet Interconnect Express (UCIe) enables multi-die designs for SoC design innovation beyond Moore’s Law.
Posted in Artificial Intelligence, EDA, HPC, Internet of Things, IP, Multi-Die Systems
We explain the multi-chip module packaging types & die-to-die interfaces helping chip designers create high-performance, multi-die designs in the SysMoore Era.
Posted in Artificial Intelligence, HPC, IP, Multi-Die Systems
Learn how programmable SmartNICs enable homogeneous data center networking and storage architectures while taking the load off of primary compute resources.
Posted in Cloud, EDA, HPC, IP, Multi-Die Systems, Verification
Learn how SoC design is influenced by 3DICs, system-of-chips, hyper-convergent chip designs, and AI-enabled EDA tools in the SysMoore era of chip design.
Posted in Artificial Intelligence, EDA, Multi-Die Systems
We’re looking back at 2021’s breakthroughs & milestones; explore key developments in EDA tools, SoC verification, connected vehicles, and life at Synopsys.
Posted in Automotive, EDA, HPC, Inside Synopsys, IP, Multi-Die Systems, Prototyping, Quantum Computing, Verification
