From Silicon To Software

Archive for the 'Multi-Die Systems' Category

 

New Systems of Chips: From Smart to Smarter

Explore the impact of AI and ML on the chip design industry and learn how chiplet-enabled multi-die systems solve processing, memory, and bandwidth limitations.

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Posted in Artificial Intelligence, EDA, Multi-Die Systems

 

Why 2023 Holds Big Promise for Multi-Die Systems

Learn why 2023 will be big for multi-die systems, as chip designers use chiplet technology and the UCIe standard to meet growing PPA requirements in HPC & beyond.

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Posted in Multi-Die Systems

 

3 Key Technologies that Will Transform Electronic Design in 2023

Three key technologies will transform electronic design in 2023, including cloud-based EDA tools, multi-die systems, and silicon lifecycle management (SLM).

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Posted in Cloud, EDA, Multi-Die Systems

 

A Year in Review: A Recap of Key Technology Advances and Adventures in 2022

We recap 2022 at Synopsys, including cloud-based chip design tools, machine learning and AI-powered EDA solutions, multi-die systems, and secure interface IP.

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Posted in Artificial Intelligence, Cloud, EDA, HPC, Inside Synopsys, IP, Multi-Die Systems, Photonics

 

How 3DICs Are Sparking a New Wave of Product Innovation

Explore the multi-die 3DIC technology that’s helping chip designers meet growing compute demands, including chiplets, 3D stacking, nanosystems, and more.

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Posted in Multi-Die Systems

 

UCIe Heralds a Robust Chiplet Ecosystem for a New Era of SoC Innovation

We explain chiplets and share how Universal Chiplet Interconnect Express (UCIe) enables multi-die designs for SoC design innovation beyond Moore’s Law.

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Posted in Artificial Intelligence, EDA, HPC, Internet of Things, IP, Multi-Die Systems

 

A Primer on Chip Packaging for Multi-Die Designs

We explain the multi-chip module packaging types & die-to-die interfaces helping chip designers create high-performance, multi-die designs in the SysMoore Era.

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Posted in Artificial Intelligence, HPC, IP, Multi-Die Systems

 

How Can SmartNICs Move Your Data Center Forward?

Learn how programmable SmartNICs enable homogeneous data center networking and storage architectures while taking the load off of primary compute resources.

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Posted in Cloud, EDA, HPC, IP, Multi-Die Systems, Verification

 

What It Takes to Design SoCs for the SysMoore Era

Learn how SoC design is influenced by 3DICs, system-of-chips, hyper-convergent chip designs, and AI-enabled EDA tools in the SysMoore era of chip design.

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Posted in Artificial Intelligence, EDA, Multi-Die Systems

 

A Year in Review: A Recap of Key Milestones and Moments in 2021

We’re looking back at 2021’s breakthroughs & milestones; explore key developments in EDA tools, SoC verification, connected vehicles, and life at Synopsys.

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Posted in Automotive, EDA, HPC, Inside Synopsys, IP, Multi-Die Systems, Prototyping, Quantum Computing, Verification