From Silicon To Software

Archive for the 'Machine Learning' Category

 

With AI-Driven Chip Design, So Much Is Possible

We explain how AI-powered chip design opens new doors for chip makers and how AI chips at the edge & hyperscale data centers are increasing compute performance.

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Posted in Artificial Intelligence, EDA, Machine Learning

 

3 Key Challenges for Memory Chip Designers to Tackle

Explore three key memory chip design challenges and the electronic design automation (EDA) tools helping designers optimize PPA, turnaround time, and more.

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Posted in Artificial Intelligence, Automotive, EDA, HPC, Internet of Things, IP, Machine Learning

 

How Do You Know When Chip Verification Is Truly Finished?

We explore chip design verification and EDA tools that increase functional verification efficiency to meet coverage goals and find more bugs in less time.

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Posted in Artificial Intelligence, Machine Learning, Verification

 

4 Futuristic Design Takeaways from the AI Hardware Summit 2021

We share AI chip design insights from AI Hardware Summit 2021, including wafer scale AI accelerator chips, high-bandwidth memory interfaces, and custom SoCs.

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Posted in Artificial Intelligence, EDA, Machine Learning

 

Sharpen Your Silicon Design Expertise at Synopsys Events this Fall

Fall 2021 silicon design events are almost here! Join us for ARC Processor Virtual Summit, Verification Day 2021, and the Digital Design Technology Symposium.

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Posted in 3D-ICs, Artificial Intelligence, Automotive, EDA, HPC, Inside Synopsys, Internet of Things, IP, Machine Learning, Power, Verification

 

Why Hyper-Convergent Designs Demand an All or Nothing Approach

We explain the importance of hyper-convergent-friendly chip design tools for larger, more complex IC designs powering HPC & advanced software infrastructure.

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Posted in 3D-ICs, Artificial Intelligence, EDA, HPC, Machine Learning

 

Synopsys Makes Headlines with PrimeSim Continuum, an Innovative Circuit Simulation Solution

Our new IC design tool, PrimeSim Continuum, enables the next generation of hyper-convergent IC designs. Learn more from eeNews, Electronic Design & EE Times.

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Posted in 3D-ICs, EDA, Machine Learning, Product Spotlight, Prototyping, Verification

 

PrimeSim Continuum Meets the Challenge of Hyper-Convergent ICs with Faster SPICE Engines and a More Unified Simulation Workflow

Learn how PrimeSim Continuum, our new IC design solution, delivers the IC verification tools & SPICE simulation speed needed for modern hyper-convergent ICs.

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Posted in 3D-ICs, EDA, Machine Learning, Product Spotlight, Prototyping, Verification

 

Onward and Upward: Enhancing 3DIC Design Productivity with a Unified Platform

3D ICs help SoC designers extend the design scale beyond Moore’s Law; learn how unified 3D IC design tools enable faster convergence for multi-die chips.

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Posted in 3D-ICs, 5G, Artificial Intelligence, HPC, Machine Learning

 

Why Datapath Validation Is Important—and How HECTOR Technology Can Help

With DVCon 2021 on the horizon we share a primer on our datapath verification technology HECTOR, exploring its impact on machine learning & AI chip design.

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Posted in Artificial Intelligence, Machine Learning, Verification