How Bandwidth-Hungry Applications Are Changing Data Center Architectures
Explore the advantages of data center disaggregation and learn how optical interconnects enable this new architecture with the help of co-packaged optics.
Explore the advantages of data center disaggregation and learn how optical interconnects enable this new architecture with the help of co-packaged optics.
Explore the world of industry standards development and learn how the 800G Ethernet standard impacts high-bandwidth connectivity for networking & data centers.
PCIe 5.0 designs are currently in massive deployment; learn about the standard and explore PCIe 5.0 applications and the importance of silicon-proven IP.
Posted in Automotive, Cloud, HPC, IP
High performance computing continues to expand & evolve; our team shares their 2022 HPC predictions including new HPC applications and processor architectures.
Posted in HPC
Explore the importance of system interoperability in hyperscale data centers and why it matters for AI and high-performance computing (HPC) applications.
Posted in Artificial Intelligence, HPC, IP
We’re looking back at 2021’s breakthroughs & milestones; explore key developments in EDA tools, SoC verification, connected vehicles, and life at Synopsys.
Posted in 3D-ICs, Automotive, EDA, HPC, Inside Synopsys, IP, Prototyping, Quantum Computing, Verification
Explore three key memory chip design challenges and the electronic design automation (EDA) tools helping designers optimize PPA, turnaround time, and more.
Posted in Artificial Intelligence, Automotive, EDA, HPC, Internet of Things, IP, Machine Learning
We explain the growth of High-Performance Computing (HPC) applications and the chip-design advantages of using silicon-proven SoC IP for HPC processor designs.
Learn how chiplets form the basis of multi-die HPC processor architectures, fueling modern HPC applications and scaling performance & power beyond Moore’s Law.
Fall 2021 silicon design events are almost here! Join us for ARC Processor Virtual Summit, Verification Day 2021, and the Digital Design Technology Symposium.
Posted in 3D-ICs, Artificial Intelligence, Automotive, EDA, HPC, Inside Synopsys, Internet of Things, IP, Machine Learning, Power, Verification