We recap 2022 at Synopsys, including cloud-based chip design tools, machine learning and AI-powered EDA solutions, multi-die systems, and secure interface IP.
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Posted in Artificial Intelligence, Cloud, EDA, HPC, Inside Synopsys, IP, Multi-Die Systems, Photonics
Explore the key components of high-performance computing and learn how to design reliability, availability, and serviceability (RAS) into HPC clusters & systems.
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Posted in EDA, HPC, IP
We explain chiplets and share how Universal Chiplet Interconnect Express (UCIe) enables multi-die designs for SoC design innovation beyond Moore’s Law.
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Posted in Artificial Intelligence, EDA, HPC, Internet of Things, IP, Multi-Die Systems
We explain the multi-chip module packaging types & die-to-die interfaces helping chip designers create high-performance, multi-die designs in the SysMoore Era.
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Posted in Artificial Intelligence, HPC, IP, Multi-Die Systems
Learn how programmable SmartNICs enable homogeneous data center networking and storage architectures while taking the load off of primary compute resources.
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Posted in Cloud, EDA, HPC, IP, Multi-Die Systems, Verification
Explore data center history including data volume growth, new data center architectures, hyperscalers, and the influence of high performance computing (HPC).
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Posted in HPC
Explore the advantages of data center disaggregation and learn how optical interconnects enable this new architecture with the help of co-packaged optics.
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Posted in HPC, IP
Explore the world of industry standards development and learn how the 800G Ethernet standard impacts high-bandwidth connectivity for networking & data centers.
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Posted in HPC, IP
PCIe 5.0 designs are currently in massive deployment; learn about the standard and explore PCIe 5.0 applications and the importance of silicon-proven IP.
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Posted in Automotive, Cloud, HPC, IP
High performance computing continues to expand & evolve; our team shares their 2022 HPC predictions including new HPC applications and processor architectures.
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Posted in HPC