We explore why signal integrity and power integrity analysis tools are critical in developing high-speed chip designs for high-bandwidth memory, AI, and more.
Posted in EDA
Explore the impact of AI and ML on the chip design industry and learn how chiplet-enabled multi-die systems solve processing, memory, and bandwidth limitations.
Posted in Artificial Intelligence, EDA, Multi-Die Systems
President & COO Sassine Ghazi explained how AI can transform chip design flows into autonomous design instruments during his 2022 AI Hardware Summit keynote.
Posted in Artificial Intelligence, EDA, Machine Learning
Learn how software verification & robust infrastructure safeguard automotive OTA updates to improve ADAS and automotive cybersecurity for connected vehicles.
Posted in Automotive, EDA, IP
Three key technologies will transform electronic design in 2023, including cloud-based EDA tools, multi-die systems, and silicon lifecycle management (SLM).
Posted in Cloud, EDA, Multi-Die Systems
We recap 2022 at Synopsys, including cloud-based chip design tools, machine learning and AI-powered EDA solutions, multi-die systems, and secure interface IP.
Posted in Artificial Intelligence, Cloud, EDA, HPC, Inside Synopsys, IP, Multi-Die Systems, Photonics
Explore the key components of high-performance computing and learn how to design reliability, availability, and serviceability (RAS) into HPC clusters & systems.
We share the four ways digitizing memory chip design & verification saves time, and explore key chip design & verification tools for advanced memory devices.
Posted in EDA
We explore hyperscale datacenters & internet traffic’s impact on climate change and discuss how energy-efficient system design shapes a sustainable future.
We’re joining Intel Foundry Services’ USMAG (United States Military, Aerospace and Government) Alliance to help bolster US semiconductor design & manufacturing.
Posted in Aerospace and Government, EDA, IP
