We explore why signal integrity and power integrity analysis tools are critical in developing high-speed chip designs for high-bandwidth memory, AI, and more.
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Posted in EDA
Explore the impact of AI and ML on the chip design industry and learn how chiplet-enabled multi-die systems solve processing, memory, and bandwidth limitations.
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Posted in Artificial Intelligence, EDA, Multi-Die Systems
President & COO Sassine Ghazi explained how AI can transform chip design flows into autonomous design instruments during his 2022 AI Hardware Summit keynote.
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Posted in Artificial Intelligence, EDA, Machine Learning
Learn how software verification & robust infrastructure safeguard automotive OTA updates to improve ADAS and automotive cybersecurity for connected vehicles.
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Posted in Automotive, EDA, IP
Three key technologies will transform electronic design in 2023, including cloud-based EDA tools, multi-die systems, and silicon lifecycle management (SLM).
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Posted in Cloud, EDA, Multi-Die Systems
We recap 2022 at Synopsys, including cloud-based chip design tools, machine learning and AI-powered EDA solutions, multi-die systems, and secure interface IP.
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Posted in Artificial Intelligence, Cloud, EDA, HPC, Inside Synopsys, IP, Multi-Die Systems, Photonics
Explore the key components of high-performance computing and learn how to design reliability, availability, and serviceability (RAS) into HPC clusters & systems.
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Posted in EDA, HPC, IP
We share the four ways digitizing memory chip design & verification saves time, and explore key chip design & verification tools for advanced memory devices.
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Posted in EDA
We explore hyperscale datacenters & internet traffic’s impact on climate change and discuss how energy-efficient system design shapes a sustainable future.
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Posted in EDA, IP, Power
We’re joining Intel Foundry Services’ USMAG (United States Military, Aerospace and Government) Alliance to help bolster US semiconductor design & manufacturing.
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Posted in Aerospace and Government, EDA, IP