From chiplet-powered multi-die systems to EDA workflows in the cloud, stay on top of the electronics industry’s latest trends at SNUG Silicon Valley 2023!
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Posted in Artificial Intelligence, Cloud, EDA, IP, Multi-Die Systems
We explain how cloud-based hardware IP verification saves valuable time in the hardware design flow by automating SoC simulation and reducing time to debug.
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Posted in Cloud, Verification
See how we enhanced the PCIe 6.0 specification’s data transfer speed with the industry’s first two-party 64 GT/s linkup through our partnership with Keysight.
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Posted in Artificial Intelligence, Cloud, HPC, IP
Part of the PCIe 6.0 specification, learn how the TEE Device Interface Security Protocol (TDISP) secures I/O virtualization & enables secure key exchange.
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Posted in Cloud, IP, Security
Explore predictions for cloud computing in 2023, including datacenters and cloud deployment models, chip verification in the cloud, and cloud-based EDA tools.
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Posted in Cloud
Three key technologies will transform electronic design in 2023, including cloud-based EDA tools, multi-die systems, and silicon lifecycle management (SLM).
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Posted in Cloud, EDA, Multi-Die Systems
We recap 2022 at Synopsys, including cloud-based chip design tools, machine learning and AI-powered EDA solutions, multi-die systems, and secure interface IP.
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Posted in Artificial Intelligence, Cloud, EDA, HPC, Inside Synopsys, IP, Multi-Die Systems, Photonics
We share 6 key advantages of cloud-based IC hardware design tools, including enhanced scalability, security, and access to AI-enabled EDA tools.
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Posted in Cloud, EDA
Learn about the new PCIe 6.0.1 specification and explore the role of PCI-SIG certified controller & verification IP for end-to-end protocol verification.
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Posted in Cloud, Internet of Things, IP, Verification
Learn how programmable SmartNICs enable homogeneous data center networking and storage architectures while taking the load off of primary compute resources.
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Posted in Cloud, EDA, HPC, IP, Multi-Die Systems, Verification