From chiplet-powered multi-die systems to EDA workflows in the cloud, stay on top of the electronics industry’s latest trends at SNUG Silicon Valley 2023!
Posted in Artificial Intelligence, Cloud, EDA, IP, Multi-Die Systems
We explain how cloud-based hardware IP verification saves valuable time in the hardware design flow by automating SoC simulation and reducing time to debug.
Posted in Cloud, Verification
See how we enhanced the PCIe 6.0 specification’s data transfer speed with the industry’s first two-party 64 GT/s linkup through our partnership with Keysight.
Posted in Artificial Intelligence, Cloud, HPC, IP
Part of the PCIe 6.0 specification, learn how the TEE Device Interface Security Protocol (TDISP) secures I/O virtualization & enables secure key exchange.
Explore predictions for cloud computing in 2023, including datacenters and cloud deployment models, chip verification in the cloud, and cloud-based EDA tools.
Posted in Cloud
Three key technologies will transform electronic design in 2023, including cloud-based EDA tools, multi-die systems, and silicon lifecycle management (SLM).
Posted in Cloud, EDA, Multi-Die Systems
We recap 2022 at Synopsys, including cloud-based chip design tools, machine learning and AI-powered EDA solutions, multi-die systems, and secure interface IP.
Posted in Artificial Intelligence, Cloud, EDA, HPC, Inside Synopsys, IP, Multi-Die Systems, Photonics
We share 6 key advantages of cloud-based IC hardware design tools, including enhanced scalability, security, and access to AI-enabled EDA tools.
Learn about the new PCIe 6.0.1 specification and explore the role of PCI-SIG certified controller & verification IP for end-to-end protocol verification.
Posted in Cloud, Internet of Things, IP, Verification
Learn how programmable SmartNICs enable homogeneous data center networking and storage architectures while taking the load off of primary compute resources.
Posted in Cloud, EDA, HPC, IP, Multi-Die Systems, Verification
