We share our predictions for high performance computing (HPC) in 2023, including the growth of edge computing solutions and the rise of AI and machine learning.
Explore the impact of AI and ML on the chip design industry and learn how chiplet-enabled multi-die systems solve processing, memory, and bandwidth limitations.
President & COO Sassine Ghazi explained how AI can transform chip design flows into autonomous design instruments during his 2022 AI Hardware Summit keynote.
We recap 2022 at Synopsys, including cloud-based chip design tools, machine learning and AI-powered EDA solutions, multi-die systems, and secure interface IP.
See how silicon remastering eases the chip supply shortage by migrating old designs to modern process nodes to expand semiconductor manufacturing capacity.
Learn how our partnership with SiMA.ai enables embedded edge machine learning applications with programmable processor IP cores and a software-driven ML SoC.
See how virtual prototyping, chip verification, and EDA tools helped Neuchips design an AI accelerator chip for the deep learning recommendation model (DLRM).
Alongside AI-enabled SoC design tools, our QuickStart Implementation Kits help chip designers develop high-performance processors for embedded applications.
We explain chiplets and share how Universal Chiplet Interconnect Express (UCIe) enables multi-die designs for SoC design innovation beyond Moore’s Law.
We explain the multi-chip module packaging types & die-to-die interfaces helping chip designers create high-performance, multi-die designs in the SysMoore Era.