From Silicon To Software

Archive for the 'Artificial Intelligence' Category

 

Top 5 HPC Trends to Come in 2023

We share our predictions for high performance computing (HPC) in 2023, including the growth of edge computing solutions and the rise of AI and machine learning.

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Posted in Artificial Intelligence, HPC, Machine Learning

 

New Systems of Chips: From Smart to Smarter

Explore the impact of AI and ML on the chip design industry and learn how chiplet-enabled multi-die systems solve processing, memory, and bandwidth limitations.

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Posted in Artificial Intelligence, EDA, Multi-Die Systems

 

Navigating the Era of Autonomous Design for Powerful Compute with Hardware

President & COO Sassine Ghazi explained how AI can transform chip design flows into autonomous design instruments during his 2022 AI Hardware Summit keynote.

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Posted in Artificial Intelligence, EDA, Machine Learning

 

A Year in Review: A Recap of Key Technology Advances and Adventures in 2022

We recap 2022 at Synopsys, including cloud-based chip design tools, machine learning and AI-powered EDA solutions, multi-die systems, and secure interface IP.

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Posted in Artificial Intelligence, Cloud, EDA, HPC, Inside Synopsys, IP, Multi-Die Systems, Photonics

 

The Power of Silicon Remastering for Addressing Chip Supply Pressures

See how silicon remastering eases the chip supply shortage by migrating old designs to modern process nodes to expand semiconductor manufacturing capacity.

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Posted in Artificial Intelligence, EDA

 

SiMa.ai Teams with Synopsys to Ease the Path to Deliver ML Applications for the Embedded Edge

Learn how our partnership with SiMA.ai enables embedded edge machine learning applications with programmable processor IP cores and a software-driven ML SoC.

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Posted in Artificial Intelligence, Customer Spotlight, IP

 

Customer Spotlight: Neuchips Tapes Out Groundbreaking AI Accelerator

See how virtual prototyping, chip verification, and EDA tools helped Neuchips design an AI accelerator chip for the deep learning recommendation model (DLRM).

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Posted in Artificial Intelligence, Customer Spotlight, IP, Verification

 

Optimizing High-Performance Processor Designs with AI-Enabled Implementation Kits

Alongside AI-enabled SoC design tools, our QuickStart Implementation Kits help chip designers develop high-performance processors for embedded applications.

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Posted in 5G, Artificial Intelligence, Automotive, IP

 

UCIe Heralds a Robust Chiplet Ecosystem for a New Era of SoC Innovation

We explain chiplets and share how Universal Chiplet Interconnect Express (UCIe) enables multi-die designs for SoC design innovation beyond Moore’s Law.

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Posted in Artificial Intelligence, EDA, HPC, Internet of Things, IP, Multi-Die Systems

 

A Primer on Chip Packaging for Multi-Die Designs

We explain the multi-chip module packaging types & die-to-die interfaces helping chip designers create high-performance, multi-die designs in the SysMoore Era.

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Posted in Artificial Intelligence, HPC, IP, Multi-Die Systems