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Archive for the '3D-ICs' Category

 

Synopsys Makes Headlines with PrimeSim Continuum, an Innovative Circuit Simulation Solution

Our new IC design tool, PrimeSim Continuum, enables the next generation of hyper-convergent IC designs. Learn more from eeNews, Electronic Design & EE Times.

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Posted in 3D-ICs, EDA, Machine Learning, Product Spotlight, Prototyping, Verification

 

Advanced Nodes Drive Demand for Advanced Library Characterization and Validation Solutions

Introducing PrimeLib, an SoC design tool that maps the latest chip technologies & enables correct-by-construction design for SoCs at advanced process nodes.

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Posted in 3D-ICs, EDA, Prototyping, Verification

 

PrimeSim Continuum Meets the Challenge of Hyper-Convergent ICs with Faster SPICE Engines and a More Unified Simulation Workflow

Learn how PrimeSim Continuum, our new IC design solution, delivers the IC verification tools & SPICE simulation speed needed for modern hyper-convergent ICs.

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Posted in 3D-ICs, EDA, Machine Learning, Product Spotlight, Prototyping, Verification

 

Scaling FPGA-Based Prototyping to Meet Verification Demands of Complex SoCs

Explore the history of FPGA prototyping in the SoC design/verification process and learn about HAPS-100, a new prototyping system for complex AI & HPC SoCs.

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Posted in 3D-ICs, 5G, Artificial Intelligence, EDA, HPC, Prototyping, Verification

 

Why Hyper-Convergent Chip Designs Call for a New Approach to Circuit Simulation

We explore how EDA tools enable hyper-convergent IC designs, supporting the PPA and yield targets required by advanced 3DICs and SoCs used in AI and HPC.

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Posted in 3D-ICs, Artificial Intelligence, EDA, HPC

 

Onward and Upward: Enhancing 3DIC Design Productivity with a Unified Platform

3D ICs help SoC designers extend the design scale beyond Moore’s Law; learn how unified 3D IC design tools enable faster convergence for multi-die chips.

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Posted in 3D-ICs, 5G, Artificial Intelligence, HPC, Machine Learning