3DIC technology is enjoying a surge in popularity; learn how IC design engineering innovations help chip designers take a silicon-first approach to 3DIC design.
Data & analytics have a massive impact on the chip design process; we explore how fast/precise chip data analytics solutions improve IC design quality & yield.
Die-to-die interfaces in hyperscale data centers require high bandwidth & low latency, learn how this innovation drives modern high-performance computing (HPC).
We explain the importance of hyper-convergent-friendly chip design tools for larger, more complex IC designs powering HPC & advanced software infrastructure.
Our new IC design tool, PrimeSim Continuum, enables the next generation of hyper-convergent IC designs. Learn more from eeNews, Electronic Design & EE Times.
Introducing PrimeLib, an SoC design tool that maps the latest chip technologies & enables correct-by-construction design for SoCs at advanced process nodes.
PrimeSim Continuum Meets the Challenge of Hyper-Convergent ICs with Faster SPICE Engines and a More Unified Simulation Workflow
Learn how PrimeSim Continuum, our new IC design solution, delivers the IC verification tools & SPICE simulation speed needed for modern hyper-convergent ICs.
Explore the history of FPGA prototyping in the SoC design/verification process and learn about HAPS-100, a new prototyping system for complex AI & HPC SoCs.
We explore how EDA tools enable hyper-convergent IC designs, supporting the PPA and yield targets required by advanced 3DICs and SoCs used in AI and HPC.
3D ICs help SoC designers extend the design scale beyond Moore’s Law; learn how unified 3D IC design tools enable faster convergence for multi-die chips.