3DIC Design: Optimizing PPA Per Cubic mm Requires a New Approach
3DIC technology is enjoying a surge in popularity; learn how IC design engineering innovations help chip designers take a silicon-first approach to 3DIC design.
The Importance of Chip Manufacturing & Test Data Analytics in the Semiconductor Industry
Data & analytics have a massive impact on the chip design process; we explore how fast/precise chip data analytics solutions improve IC design quality & yield.
How to Achieve High Bandwidth and Low Latency Die-to-Die Connectivity
Die-to-die interfaces in hyperscale data centers require high bandwidth & low latency, learn how this innovation drives modern high-performance computing (HPC).
Posted in 3D-ICs, Artificial Intelligence, HPC, IP
Why Hyper-Convergent Designs Demand an All or Nothing Approach
We explain the importance of hyper-convergent-friendly chip design tools for larger, more complex IC designs powering HPC & advanced software infrastructure.
Posted in 3D-ICs, Artificial Intelligence, EDA, HPC, Machine Learning
Synopsys Makes Headlines with PrimeSim Continuum, an Innovative Circuit Simulation Solution
Our new IC design tool, PrimeSim Continuum, enables the next generation of hyper-convergent IC designs. Learn more from eeNews, Electronic Design & EE Times.
Posted in 3D-ICs, EDA, Machine Learning, Product Spotlight, Prototyping, Verification
Advanced Nodes Drive Demand for Advanced Library Characterization and Validation Solutions
Introducing PrimeLib, an SoC design tool that maps the latest chip technologies & enables correct-by-construction design for SoCs at advanced process nodes.
Posted in 3D-ICs, EDA, Prototyping, Verification
PrimeSim Continuum Meets the Challenge of Hyper-Convergent ICs with Faster SPICE Engines and a More Unified Simulation Workflow
Learn how PrimeSim Continuum, our new IC design solution, delivers the IC verification tools & SPICE simulation speed needed for modern hyper-convergent ICs.
Posted in 3D-ICs, EDA, Machine Learning, Product Spotlight, Prototyping, Verification
Scaling FPGA-Based Prototyping to Meet Verification Demands of Complex SoCs
Explore the history of FPGA prototyping in the SoC design/verification process and learn about HAPS-100, a new prototyping system for complex AI & HPC SoCs.
Posted in 3D-ICs, 5G, Artificial Intelligence, EDA, HPC, Prototyping, Verification
Why Hyper-Convergent Chip Designs Call for a New Approach to Circuit Simulation
We explore how EDA tools enable hyper-convergent IC designs, supporting the PPA and yield targets required by advanced 3DICs and SoCs used in AI and HPC.
Posted in 3D-ICs, Artificial Intelligence, EDA, HPC
Onward and Upward: Enhancing 3DIC Design Productivity with a Unified Platform
3D ICs help SoC designers extend the design scale beyond Moore’s Law; learn how unified 3D IC design tools enable faster convergence for multi-die chips.
Posted in 3D-ICs, 5G, Artificial Intelligence, HPC, Machine Learning
