Learn how SoC design is influenced by 3DICs, system-of-chips, hyper-convergent chip designs, and AI-enabled EDA tools in the SysMoore era of chip design.
We’re looking back at 2021’s breakthroughs & milestones; explore key developments in EDA tools, SoC verification, connected vehicles, and life at Synopsys.
Explore the latest on hyper-convergent chip designs, IC hyperconvergence, and the EDA tools enabling 3DICs and more in the SysMoore era of semiconductor design.
Learn how chiplets form the basis of multi-die HPC processor architectures, fueling modern HPC applications and scaling performance & power beyond Moore’s Law.
Fall 2021 silicon design events are almost here! Join us for ARC Processor Virtual Summit, Verification Day 2021, and the Digital Design Technology Symposium.
Explore the growing popularity of multi-die chip designs and learn how a system-level view helps chip designers reach aggressive PPA targets for data centers.
3DIC technology is enjoying a surge in popularity; learn how IC design engineering innovations help chip designers take a silicon-first approach to 3DIC design.
Data & analytics have a massive impact on the chip design process; we explore how fast/precise chip data analytics solutions improve IC design quality & yield.
Die-to-die interfaces in hyperscale data centers require high bandwidth & low latency, learn how this innovation drives modern high-performance computing (HPC).
We explain the importance of hyper-convergent-friendly chip design tools for larger, more complex IC designs powering HPC & advanced software infrastructure.