Learn how SoC design is influenced by 3DICs, system-of-chips, hyper-convergent chip designs, and AI-enabled EDA tools in the SysMoore era of chip design.
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Posted in 3D-ICs, Artificial Intelligence, EDA
We’re looking back at 2021’s breakthroughs & milestones; explore key developments in EDA tools, SoC verification, connected vehicles, and life at Synopsys.
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Posted in 3D-ICs, Automotive, EDA, HPC, Inside Synopsys, IP, Prototyping, Quantum Computing, Verification
Explore the latest on hyper-convergent chip designs, IC hyperconvergence, and the EDA tools enabling 3DICs and more in the SysMoore era of semiconductor design.
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Posted in 3D-ICs, EDA, IP
Learn how chiplets form the basis of multi-die HPC processor architectures, fueling modern HPC applications and scaling performance & power beyond Moore’s Law.
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Posted in 3D-ICs, HPC
Fall 2021 silicon design events are almost here! Join us for ARC Processor Virtual Summit, Verification Day 2021, and the Digital Design Technology Symposium.
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Posted in 3D-ICs, Artificial Intelligence, Automotive, EDA, HPC, Inside Synopsys, Internet of Things, IP, Machine Learning, Power, Verification
Explore the growing popularity of multi-die chip designs and learn how a system-level view helps chip designers reach aggressive PPA targets for data centers.
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Posted in 3D-ICs, 5G, Artificial Intelligence, HPC, IP
3DIC technology is enjoying a surge in popularity; learn how IC design engineering innovations help chip designers take a silicon-first approach to 3DIC design.
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Posted in 3D-ICs, EDA
Data & analytics have a massive impact on the chip design process; we explore how fast/precise chip data analytics solutions improve IC design quality & yield.
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Posted in 3D-ICs, EDA
Die-to-die interfaces in hyperscale data centers require high bandwidth & low latency, learn how this innovation drives modern high-performance computing (HPC).
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Posted in 3D-ICs, Artificial Intelligence, HPC, IP
We explain the importance of hyper-convergent-friendly chip design tools for larger, more complex IC designs powering HPC & advanced software infrastructure.
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Posted in 3D-ICs, Artificial Intelligence, EDA, HPC, Machine Learning