Learn how chiplets form the basis of multi-die HPC processor architectures, fueling modern HPC applications and scaling performance & power beyond Moore’s Law.
Fall 2021 silicon design events are almost here! Join us for ARC Processor Virtual Summit, Verification Day 2021, and the Digital Design Technology Symposium.
Explore the growing popularity of multi-die chip designs and learn how a system-level view helps chip designers reach aggressive PPA targets for data centers.
3DIC technology is enjoying a surge in popularity; learn how IC design engineering innovations help chip designers take a silicon-first approach to 3DIC design.
Data & analytics have a massive impact on the chip design process; we explore how fast/precise chip data analytics solutions improve IC design quality & yield.
Die-to-die interfaces in hyperscale data centers require high bandwidth & low latency, learn how this innovation drives modern high-performance computing (HPC).
We explain the importance of hyper-convergent-friendly chip design tools for larger, more complex IC designs powering HPC & advanced software infrastructure.
Our new IC design tool, PrimeSim Continuum, enables the next generation of hyper-convergent IC designs. Learn more from eeNews, Electronic Design & EE Times.
Introducing PrimeLib, an SoC design tool that maps the latest chip technologies & enables correct-by-construction design for SoCs at advanced process nodes.
PrimeSim Continuum Meets the Challenge of Hyper-Convergent ICs with Faster SPICE Engines and a More Unified Simulation Workflow
Learn how PrimeSim Continuum, our new IC design solution, delivers the IC verification tools & SPICE simulation speed needed for modern hyper-convergent ICs.