From Silicon To Software

Archive for the '3D-ICs' Category

 

What It Takes to Design SoCs for the SysMoore Era

Learn how SoC design is influenced by 3DICs, system-of-chips, hyper-convergent chip designs, and AI-enabled EDA tools in the SysMoore era of chip design.

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Posted in 3D-ICs, Artificial Intelligence, EDA

 

A Year in Review: A Recap of Key Milestones and Moments in 2021

We’re looking back at 2021’s breakthroughs & milestones; explore key developments in EDA tools, SoC verification, connected vehicles, and life at Synopsys.

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Posted in 3D-ICs, Automotive, EDA, HPC, Inside Synopsys, IP, Prototyping, Quantum Computing, Verification

 

5 Things You Need to Know About Hyper-Convergent Chip Designs

Explore the latest on hyper-convergent chip designs, IC hyperconvergence, and the EDA tools enabling 3DICs and more in the SysMoore era of semiconductor design.

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Posted in 3D-ICs, EDA, IP

 

What’s Driving the Demand for Chiplets?

Learn how chiplets form the basis of multi-die HPC processor architectures, fueling modern HPC applications and scaling performance & power beyond Moore’s Law.

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Posted in 3D-ICs, HPC

 

Sharpen Your Silicon Design Expertise at Synopsys Events this Fall

Fall 2021 silicon design events are almost here! Join us for ARC Processor Virtual Summit, Verification Day 2021, and the Digital Design Technology Symposium.

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Posted in 3D-ICs, Artificial Intelligence, Automotive, EDA, HPC, Inside Synopsys, Internet of Things, IP, Machine Learning, Power, Verification

 

What Is a Multi-Die Design—and What’s Driving Its Growing Popularity?

Explore the growing popularity of multi-die chip designs and learn how a system-level view helps chip designers reach aggressive PPA targets for data centers.

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Posted in 3D-ICs, 5G, Artificial Intelligence, HPC, IP

 

3DIC Design: Optimizing PPA Per Cubic mm Requires a New Approach

3DIC technology is enjoying a surge in popularity; learn how IC design engineering innovations help chip designers take a silicon-first approach to 3DIC design.

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Posted in 3D-ICs, EDA

 

The Importance of Chip Manufacturing & Test Data Analytics in the Semiconductor Industry

Data & analytics have a massive impact on the chip design process; we explore how fast/precise chip data analytics solutions improve IC design quality & yield.

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Posted in 3D-ICs, EDA

 

How to Achieve High Bandwidth and Low Latency Die-to-Die Connectivity

Die-to-die interfaces in hyperscale data centers require high bandwidth & low latency, learn how this innovation drives modern high-performance computing (HPC).

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Posted in 3D-ICs, Artificial Intelligence, HPC, IP

 

Why Hyper-Convergent Designs Demand an All or Nothing Approach

We explain the importance of hyper-convergent-friendly chip design tools for larger, more complex IC designs powering HPC & advanced software infrastructure.

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Posted in 3D-ICs, Artificial Intelligence, EDA, HPC, Machine Learning