How Die-to-Die Connectivity Is Advancing High-Performance Computing
HPC solutions are in high demand; learn how die-to-die connectivity enables new multi-chip module SoCs that provide higher yield & power for HPC applications.
Scott Durrant is the cloud computing and HPC strategic marketing manager for the Solutions Group at Synopsys. He is responsible for driving Synopsys’ cloud and HPC market IP initiatives, including strategic business and market trend analysis. Prior to Synopsys, Scott worked for Intel, NAVEX Global, and McAfee, where he held product management, product and technical marketing, software and systems engineering, and strategic planning roles for enterprise data center and cloud products and services, including networking and server IP, chip, and system-level products. Scott holds a B.S. in electrical engineering and an MBA from Brigham Young University.
HPC solutions are in high demand; learn how die-to-die connectivity enables new multi-chip module SoCs that provide higher yield & power for HPC applications.
In the era of Smart Everything—where devices are getting smarter and everything is connected—Synopsys technology is at the heart of innovations that are changing the way we live. Read on to get the latest look at trends in semiconductor chip design, verification, IP integration, and software security and quality. Learn about the ins and outs of electronic design automation from our industry-leading experts and how silicon and software are powering the automotive, artificial intelligence, 5G, cloud and IoT markets.