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Simplifying AI Chip Development: Arm and Synopsys Execs Discuss Chiplet, Subsystem, and IP Integration

By Frank Malloy

3 min read / Aug 07, 2025

Tags: Multi-Die , AI & Machine Learning , Chip Design Insights , Design , Physical Implementation , Silicon IP , Verification , Virtual Prototyping

UCIe 3.0 Is Here: Synopsys IP Solutions Are Ready

By Varun Agrawal

3 min read / Aug 05, 2025

Tags: Multi-Die , Chip Design Insights , Design , Interface IP , Silicon IP

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By Vincent van der Leest, Frank Malloy

3 min read / Jul 31, 2025

Tags: Chip Design Insights , Design , Security IP , Silicon IP

Quantum Computing: How Advances May Reshape Our Understanding of the World

By Synopsys Editorial Staff

4 min read / Jul 29, 2025

Tags: Test , Chip Design Insights , Quantum Computing , Simulation , Design , Verification

Addressing Hardware Failures and Silent Data Corruption in the AI Infrastructure Buildout

By Shankar Krishnamoorthy, Yervant Zorian

Tags: Data Center, AI & Machine Learning, Silicon Lifecycle Management, Chip Design Insights, Design, HPC, Data Center, Silicon IP

4 min read/ Jul 08, 2025

Solving Analog Design Challenges to Power Our Digital World

By Sumit Vishwakarma

Tags: AI & Machine Learning, Memory, RF Design, Insights, Energy-Efficient SoCs, Cloud, AMS Verification, Signal & Power Integrity, Chip Design Insights, Design, AMS Simulation, Cloud Insights, Verification, Analog Design

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RTL Signoff vs. Functional Signoff: What’s the Difference?

By Bradley Geden, Manoz Palaparthi

Tags: Verification Central, Multi-Die, RTL Synthesis, Static & Formal Verification, AI & Machine Learning, Debug, Physical Verification, Test, Simulation, Energy-Efficient SoCs, Signoff, Chip Design Insights, Design, Verification, Formal Verification

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4 min read/Jul 08, 2025

Solving Analog Design Challenges to Power Our Digital World

By Sumit Vishwakarma

4 min read/Jul 08, 2025

5 min read/ Jun 10, 2025

Software-Defined Vehicles: Agile Development with Cloud-Based Virtual Prototypes

By Gunnar Braun, Stewart Williams

Tags: Cloud, Insights, Chip Design Insights, Automotive, Cloud Insights, Verification, Virtual Prototyping

5 min read/ Jun 04, 2025

Synopsys Expands Collaboration with Arm to Accelerate the Automotive Industry’s Transformation to Software-Defined Vehicles

By Tom De Schutter

Tags: Cloud, Chip Design Insights, Design, Verification IP, Automotive, Verification, Virtual Prototyping

3 min read/ May 22, 2025

Faster, More Collaborative SoC and Chiplet Architecture Exploration: Introducing Synopsys Platform Architect Development Kit (PADK)

By Kamal Desai

Tags: Verification Central, Cloud, Multi-Die, Prototyping, Chip Design Insights, Design, Verification, Virtual Prototyping

Multi-Die Systems

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3 min read/Aug 07, 2025

Simplifying AI Chip Development: Arm and Synopsys Execs Discuss Chiplet, Subsystem, and IP Integration

By Frank Malloy

3 min read/Aug 07, 2025

Tags: Multi-Die, AI & Machine Learning, Chip Design Insights, Design, Physical Implementation, Silicon IP, Verification, Virtual Prototyping

3 min read/ Aug 05, 2025

UCIe 3.0 Is Here: Synopsys IP Solutions Are Ready

By Varun Agrawal

Tags: Multi-Die, Chip Design Insights, Design, Interface IP, Silicon IP

5 min read/ Jul 01, 2025

RTL Signoff vs. Functional Signoff: What’s the Difference?

By Bradley Geden, Manoz Palaparthi

3 min read/ May 28, 2025

High Bandwidth Memory (HBM) at the AI Crossroads: Customization or Standardization?

By Synopsys Editorial Staff

Tags: Verification Central, Multi-Die, AI & Machine Learning, Memory, Chip Design Insights, Design, Interface IP, Verification IP, HPC, Data Center, Silicon IP, Verification, 3DIC Design

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Marc Serughetti

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Silicon to Systems Blog

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Spotlight

Simplifying AI Chip Development: Arm and Synopsys Execs Discuss Chiplet, Subsystem, and IP Integration

UCIe 3.0 Is Here: Synopsys IP Solutions Are Ready

Trust at the Core: A Deep Dive into Hardware Root of Trust (HRoT)

Quantum Computing: How Advances May Reshape Our Understanding of the World

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Simplifying AI Chip Development: Arm and Synopsys Execs Discuss Chiplet, Subsystem, and IP Integration

Addressing Hardware Failures and Silent Data Corruption in the AI Infrastructure Buildout

Addressing Hardware Failures and Silent Data Corruption in the AI Infrastructure Buildout

Solving Analog Design Challenges to Power Our Digital World

RTL Signoff vs. Functional Signoff: What’s the Difference?

Solving Analog Design Challenges to Power Our Digital World

Software-Defined Vehicles: Agile Development with Cloud-Based Virtual Prototypes

Software-Defined Vehicles: Agile Development with Cloud-Based Virtual Prototypes

Synopsys Expands Collaboration with Arm to Accelerate the Automotive Industry’s Transformation to Software-Defined Vehicles

Faster, More Collaborative SoC and Chiplet Architecture Exploration: Introducing Synopsys Platform Architect Development Kit (PADK)

Simplifying AI Chip Development: Arm and Synopsys Execs Discuss Chiplet, Subsystem, and IP Integration

UCIe 3.0 Is Here: Synopsys IP Solutions Are Ready

UCIe 3.0 Is Here: Synopsys IP Solutions Are Ready

RTL Signoff vs. Functional Signoff: What’s the Difference?

High Bandwidth Memory (HBM) at the AI Crossroads: Customization or Standardization?

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