We share our predictions for high performance computing (HPC) in 2023, including the growth of edge computing solutions and the rise of AI and machine learning.
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Posted in Artificial Intelligence, HPC, Machine Learning
See how Lightelligence used our Platform Architect SoC design tool to develop a multi-die system-in-package including digital, analog, and optical components.
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Posted in Customer Spotlight, Optical Design, Photonics
We explain embedded magnetoresistive random access memory (eMRAM) and its low-power SoC design applications as a non-volatile memory alternative to SRAM & Flash.
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Posted in Internet of Things, IP
We explore why signal integrity and power integrity analysis tools are critical in developing high-speed chip designs for high-bandwidth memory, AI, and more.
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Posted in EDA
Explore the impact of AI and ML on the chip design industry and learn how chiplet-enabled multi-die systems solve processing, memory, and bandwidth limitations.
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Posted in Artificial Intelligence, EDA, Multi-Die Systems
Learn why 2023 will be big for multi-die systems, as chip designers use chiplet technology and the UCIe standard to meet growing PPA requirements in HPC & beyond.
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Posted in Multi-Die Systems
Explore predictions for the automotive industry in 2023, including EV improvements, the evolution of autonomous driving tech for self-driving cars, and beyond.
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Posted in Automotive
President & COO Sassine Ghazi explained how AI can transform chip design flows into autonomous design instruments during his 2022 AI Hardware Summit keynote.
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Posted in Artificial Intelligence, EDA, Machine Learning
Explore predictions for cloud computing in 2023, including datacenters and cloud deployment models, chip verification in the cloud, and cloud-based EDA tools.
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Posted in Cloud
Returnship programs create career opportunities for those coming off mid-career breaks; explore our RIYA returnship program for engineers & computer scientists.
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Posted in Inside Synopsys