We share our predictions for high performance computing (HPC) in 2023, including the growth of edge computing solutions and the rise of AI and machine learning.
See how Lightelligence used our Platform Architect SoC design tool to develop a multi-die system-in-package including digital, analog, and optical components.
We explain embedded magnetoresistive random access memory (eMRAM) and its low-power SoC design applications as a non-volatile memory alternative to SRAM & Flash.
We explore why signal integrity and power integrity analysis tools are critical in developing high-speed chip designs for high-bandwidth memory, AI, and more.
Explore the impact of AI and ML on the chip design industry and learn how chiplet-enabled multi-die systems solve processing, memory, and bandwidth limitations.
Learn why 2023 will be big for multi-die systems, as chip designers use chiplet technology and the UCIe standard to meet growing PPA requirements in HPC & beyond.
Explore predictions for the automotive industry in 2023, including EV improvements, the evolution of autonomous driving tech for self-driving cars, and beyond.
President & COO Sassine Ghazi explained how AI can transform chip design flows into autonomous design instruments during his 2022 AI Hardware Summit keynote.
Explore predictions for cloud computing in 2023, including datacenters and cloud deployment models, chip verification in the cloud, and cloud-based EDA tools.
Returnship programs create career opportunities for those coming off mid-career breaks; explore our RIYA returnship program for engineers & computer scientists.
- 5G
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- Artificial Intelligence
- Automotive
- Cloud
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- Customer Spotlight
- EDA
- Healthcare
- HPC
- Inside Synopsys
- Internet of Things
- IP
- Machine Learning
- Malware
- Multi-Die Systems
- Optical Design
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- Product Spotlight
- Prototyping
- Quantum Computing
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- Superconducting Electronics
- TCAD
- Verification