Accelerate vision transformer models and convolutional neural networks for AI vision systems with the ARC NPX6 NPU IP, the best processor for edge AI devices.
Multi-die systems are the future of the semiconductor industry; explore the role of 3D packaging and chiplet standards including UCIe in our trends report.
Explore the design challenges of integrated thermal management solutions for multi-die systems, and how AI-enabled EDA tools help, as covered at SNUG 2023.
Chip designers are rapidly migrating to EDA tools in the cloud; learn why and explore trends in chip design tools from our panel at SNUG Silicon Valley 2023.
Explore how semiconductor companies integrate chiplets and heterogeneous dies in multi-die systems to power everything from autonomous driving to generative AI.
Chip designers are rapidly migrating to EDA tools in the cloud; learn why and explore trends in chip design tools from our panel at SNUG Silicon Valley 2023.
At SNUG Silicon Valley 2023 we hosted a panel on AI in chip design, exploring how AI-enabled EDA tools simplify SoC design, accelerate verification, and more.
Learn how low power chip design verification can be shifted left in the SoC design flow, allowing chip designers to clean up UPF issues before RTL is ready.
See how our acquisition of Silicon Frontline Technology enhances IC design tools for power semiconductor devices through power device design & ESD verification.
Learn how Impare uses cloud-based chip design verification tools and explore the time, scalability and collaboration advantages of EDA tools in the cloud.
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