New Horizons for Chip Design

Designing Smarter Edge AI Devices with the Award-Winning Synopsys ARC NPX6 NPU IP

Accelerate vision transformer models and convolutional neural networks for AI vision systems with the ARC NPX6 NPU IP, the best processor for edge AI devices.

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New Synopsys Report Highlights Key Industry Insights on the Impact of Multi-Die Systems

Multi-die systems are the future of the semiconductor industry; explore the role of 3D packaging and chiplet standards including UCIe in our trends report.

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Can the Semiconductor Industry Overcome Thermal Design Challenges in Multi-Die Systems?

Explore the design challenges of integrated thermal management solutions for multi-die systems, and how AI-enabled EDA tools help, as covered at SNUG 2023.

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Designing Chips in the Cloud: Four Key Takeaways from SNUG Silicon Valley 2023

Chip designers are rapidly migrating to EDA tools in the cloud; learn why and explore trends in chip design tools from our panel at SNUG Silicon Valley 2023.

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­­­­­How Multi-Die Systems Create New Business Opportunities for Semiconductor Companies

Explore how semiconductor companies integrate chiplets and heterogeneous dies in multi-die systems to power everything from autonomous driving to generative AI.

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How Cloud IC Verification Reduced DRC Runtimes by 65%

Chip designers are rapidly migrating to EDA tools in the cloud; learn why and explore trends in chip design tools from our panel at SNUG Silicon Valley 2023.

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What Does the Future Hold for AI in Chip Design?

At SNUG Silicon Valley 2023 we hosted a panel on AI in chip design, exploring how AI-enabled EDA tools simplify SoC design, accelerate verification, and more.

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How to Shift Left on Low-Power Design Verification, Early and Quickly

Learn how low power chip design verification can be shifted left in the SoC design flow, allowing chip designers to clean up UPF issues before RTL is ready.

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Synopsys Acquires Silicon Frontline Technology

See how our acquisition of Silicon Frontline Technology enhances IC design tools for power semiconductor devices through power device design & ESD verification.

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Imparé Imparts Its Insights on Verification in the Cloud

Learn how Impare uses cloud-based chip design verification tools and explore the time, scalability and collaboration advantages of EDA tools in the cloud.

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