Samsung DDR4-3DS 3D Stacked DIMMs using Through Silicon Vias (TSV)
It’s been about 9 months since I blogged on Samsung’s public roadmap and the fact that it carried some 3D Stacked DDR4 Devices using Through Silicon Vias (TSVs). Time for a quick update…
Posted in DDR4, DIMM, DRAM Industry, Featured, Uncategorized