Committed to Memory

Archive for the 'DIMM' Category

 

Samsung DDR4-3DS 3D Stacked DIMMs using Through Silicon Vias (TSV)

It’s been about 9 months since I blogged on Samsung’s public roadmap and the fact that it carried some 3D Stacked DDR4 Devices using Through Silicon Vias (TSVs). Time for a quick update…

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Posted in DDR4, DIMM, DRAM Industry, Featured, Uncategorized

 

Row Hammering: What it is, and how hackers could use it to gain access to your system

I have written on the topic of Row Hammering in a White Paper I published last year (link here) but since it is in the spotlight recently I thought I’d dedicate a blog entry to it. I had never considered this to be a security hole until this morning.

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Posted in DDR3, DDR4, DIMM, DRAM Industry, Signal Integrity, Uncategorized

 

Inside Samsung’s DDR4 Product Guide – DDR4-2400, 8Gb dies, TSV, and 128GB DIMMs

Samsung has posted their DDR4 product guide on their website, and it gives us excellent insight into the direction that Samsung plans to go with DDR4 in the next few months with a lot of data that wasn’t previously publicly available.

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Posted in DDR4, DIMM, DRAM Industry, Uncategorized