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By Synopsys Editorial Staff

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Synopsys Expands Collaboration with Arm to Accelerate the Automotive Industry’s Transformation to Software-Defined Vehicles

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Faster, More Collaborative SoC and Chiplet Architecture Exploration: Introducing Synopsys Platform Architect Development Kit (PADK)

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High Bandwidth Memory (HBM) at the AI Crossroads: Customization or Standardization?

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Faster, More Collaborative SoC and Chiplet Architecture Exploration: Introducing Synopsys Platform Architect Development Kit (PADK)

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Tags: Verification Central, Cloud, Multi-Die System, Prototyping, Chip Design Insights, Design, Verification, Virtual Prototyping

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Multi-Die Design Challenges: Industry Leaders Provide Insights and Guidance

By Frank Malloy

Tags: Multi-Die System, Chip Design Insights, Design, 3DIC Design

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Marc Serughetti

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Shekhar Kapoor

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Silicon to Systems Blog

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Spotlight

The Integrated Design Challenge: Developing Chip, Software, and System in Unison

Why Hardware Security Is Just as Critical as Software Security in Modern Systems

PCIe 6.x and 112 Gbps Ethernet: Synopsys and TeraSignal Achieve Optical Interconnect Breakthroughs

Software-Defined Vehicles: Agile Development with Cloud-Based Virtual Prototypes

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The Integrated Design Challenge: Developing Chip, Software, and System in Unison

High Bandwidth Memory (HBM) at the AI Crossroads: Customization or Standardization?

High Bandwidth Memory (HBM) at the AI Crossroads: Customization or Standardization?

Advancing Chip Design with AI: Synopsys AI Collaboration Featured at Microsoft Build

Skymizer Reduces Verification Cycles for AI Accelerator IP Development by 33% with Synopsys HAPS Prototyping

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Synopsys Expands Collaboration with Arm to Accelerate the Automotive Industry’s Transformation to Software-Defined Vehicles

Synopsys Expands Collaboration with Arm to Accelerate the Automotive Industry’s Transformation to Software-Defined Vehicles

Faster, More Collaborative SoC and Chiplet Architecture Exploration: Introducing Synopsys Platform Architect Development Kit (PADK)

Transforming Edge Software Development with Arm-based Virtual Prototyping

High Bandwidth Memory (HBM) at the AI Crossroads: Customization or Standardization?

Faster, More Collaborative SoC and Chiplet Architecture Exploration: Introducing Synopsys Platform Architect Development Kit (PADK)

Faster, More Collaborative SoC and Chiplet Architecture Exploration: Introducing Synopsys Platform Architect Development Kit (PADK)

Multi-Die Design Challenges: Industry Leaders Provide Insights and Guidance

Synopsys Aims to Reduce Silicon Design Cycles by up to a Year in Collaboration with Arm

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