Well after a couple of busy weeks traveling (and I am sure you really care about knowing this :)), I finally found some time to blog about our DAC AMS event held in Austin early June. We had a very successful event with some great technical presentations (hey that’s the feedback I received from the crowd..) from Micron, Broadcom, ST-Ericsson E, ARM and ST-Microelectronics. The topics ranged from low power and reliability and mixed signal verification and advanced memory characterization.
DAC 2013 AMS Verification Luncheon: Advance Your Mixed-signal Verification Techniques to the Next Level
Q&A with ST-Ericsson: Latest ERC flow innovations using CustomSim CCK for optimal verification coverage
Circuit design implementation has become increasingly complex in deep submicron technologies. Multiple processor cores, I/Os peripherals, complex analog circuits, and logic are now being implemented onto the same chip. Ensuring product reliability to meet design goals and to achieve good yield has become a crucial step in today design cycle. With complex IP, system integration, and multiple power domains, you need an extremely flexible and powerful EDA solution to tackle those circuit verification demands.
Posted in AMS Assertions, AMS Circuits, AMS EDA tools, analog, Analog and Custom Layout, analog design, Behavioral Modeling, Cell Characterization, Custom Designer, Device Modeling, EDA, Fast-SPICE, Mixed Signal/Cosimulation, Nanometer CMOS, Reliability, RF, Signal Integrity, SPICE, verification |