4 min read/May 19, 2025 Skymizer Reduces Verification Cycles for AI Accelerator IP Development by 33% with Synopsys HAPS Prototyping By Simon Han Tags: AI & Machine Learning, Physical Verification, Prototyping, Chip Design Insights, Design, Emulation, Verification
3 min read/May 18, 2025 Synopsys Interconnect IPs Enabling Scalable Compute Clusters By Neeraj Paliwal Tags: Data Center, AI & Machine Learning, Chip Design Insights, Interface IP, HPC, Data Center, Silicon IP
4 min read/May 07, 2025 AI in Engineering: How Technology is Reshaping Engineering Roles and Skills By Synopsys Editorial Staff Tags: AI & Machine Learning, Chip Design Insights, Design
3 min read/Mar 09, 2025 Transforming Edge Software Development with Arm-based Virtual Prototyping By Malte Doerper Tags: Cloud, Product Spotlight, Prototyping, Chip Design Insights, Design, Verification, Virtual Prototyping
4 min read/Nov 18, 2024 AI Startups are Using the Cloud to Accelerate Chip Design and Time-to-Market By Greg Sorber Tags: Customer Spotlight, Cloud, Chip Design Insights, Design
4 min read/Oct 21, 2024 Accelerating AI Chip Development and Reducing Risk with Pre-silicon, Secure, Cloud-based Emulation By Gerhard Scherer, Todd Koelling Tags: Cloud, Product Spotlight, Chip Design Insights, Emulation, Verification
4 min read/May 15, 2025 Multi-Die Design Challenges: Industry Leaders Provide Insights and Guidance By Frank Malloy Tags: Multi-Die System, Chip Design Insights, Design, 3DIC Design
2 min read/Feb 06, 2025 Synopsys Aims to Reduce Silicon Design Cycles by up to a Year in Collaboration with Arm By Arun Bhattacharya Tags: Multi-Die System, Chip Design Insights, Design, Interface IP, Foundation IP, Silicon IP
2 min read/Jan 21, 2025 Synopsys Bold Prediction: 50% of New HPC Chip Designs Will Be Multi-Die in 2025 By Shekhar Kapoor, Michael Posner Tags: Multi-Die System, Chip Design Insights, Design, 3DIC Compiler