Posted by Hezi Saar on March 15th, 2013
The MIPI alliance announced the release of M-PHY v3.0 in Barcelona which solidifies the Gear3 and other specs enhancements. From the press release I can quote this:
M-PHY® v3.0 delivers a low-power, scalable physical layer with a data rate range nearing 6Gbps. CSI-3 has been adopted and is available for MIPI Alliance members. LLI v2.0 and M-PHY® v3.0 are scheduled for adoption by the end of April 2013.
Synopsys launched the Industry’s first Multi-Gear M-PHY supporting Gear1, Gear2, and Gear3 which makes it future proof for new protocols back in February 2012. And in the meantime we are contributing to the M-PHY v3.0 specification as we were driving previous specifications.
Next week during the MIPI F2F meeting in Asia (demo day on March 19th), Synopsys will be demonstrating the First silicon proven M-PHY operating at High Speed Gear3 and connecting to Tektronix test equipment.
This demo shows Synopsys true leadership in driving the M-PHY v3.0 specification in the MIPI alliance PHY Work Group in parallel to IP development which allows us to be first to market and first to silicon at the time of final specification.
As M-PHY becomes a popular physical layer for many applications, we continue to see applications adjacent to mobile that would like to use it. I can quote another piece from the press release:
In addition to supporting smartphones and full-function phones, these MIPI specifications are suitable for other applications that require low power, high bandwidth – including tablets/netbooks, consumer electronics, high speed memory storage, automotive and portable medical devices.
See you next week in MIPI F2F meeting, and come see our Gear3 M-PHY demo.
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